Semiconductor laser diode encapsulating clamp

Abstract

The invention discloses a semiconductor laser diode encapsulating clamp, which comprises a socket, a front clamp seat and a back clamp seat, wherein the socket has a cylindrical structure; two V-shaped grooves are oppositely cut on the side face of the socket; three electrode jacks are processed on the end face of one side of the socket; the front clamp seat is made of a metal material and is a plate-like U-shaped pieces; the inner two sides of a U-shaped groove of the U-shaped piece are provided with two steps; both sides of the U-shaped groove are provided with two counter bores for fixing; the bottom of the U-shaped groove is arc-shaped; the back clamp seat is made of a metal material, is a stepped rectangular body and is partitioned into a large end and a small end; the center of one end face of the large end is provided with a hole for using together with the front clamp seat; the inner wall of the hole is provided with a V-shaped bump which is matched with the V-shaped groove on the socket; the periphery of the hole is provided with four screw holes corresponding to the counter bores on the front clamp seat; the front clamp seat is fixed with the screw holes on the back clamp seat through the counter bores on the front clamp seat via screws; and the socket is inserted into the hole of the back clamp seat.

Description

technical field [0001] The invention relates to a semiconductor laser diode package fixture, in particular to a diode laser package and pressure welding fixture for TO-18 package structure, which ensures that the held TO-18 tube holder is firmly mounted and heated quickly during use. , Easy loading and unloading. Background technique [0002] Semiconductor lasers have many advantages such as high power conversion efficiency and small size, and have good application prospects in the fields of pumping solid-state lasers, fiber amplifiers, industry, laser medicine, optical storage, and military. In the production of semiconductor lasers, in order to meet the needs of different fields and customers, it is often necessary to adopt many heat sinks with special structures and complex packaging forms. Low-power diode lasers often have the characteristics of small size, light weight, and irregular shape. In the production process, the laser diode needs to be welded on the tube base,...

AI Technical Summary

Problems solved by technology

During this process, the tube base needs to be heated, and since the tube base and the laser diode core are both small in size, it is inconvenient to clamp

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