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Multilayer printed circuit board and manufacturing process thereof

A multi-layer printing and manufacturing process technology, applied in the direction of multi-layer circuit manufacturing, printed circuits, electrical components, etc., can solve the problems of uneven overall thickness, easy cracking, etc., to avoid residual defects of bubbles, not easy to crack, and ensure product reliability. degree of effect

Active Publication Date: 2014-04-02
东莞市五株电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] Aiming at the problem that the printed circuit board in the prior art is prone to uneven overall thickness and easy cracking, the present invention provides a multilayer printed circuit board with uniform overall thickness and tight bonding

Method used

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  • Multilayer printed circuit board and manufacturing process thereof
  • Multilayer printed circuit board and manufacturing process thereof
  • Multilayer printed circuit board and manufacturing process thereof

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Embodiment Construction

[0028] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0029] Please also see figure 2 and image 3 ,in figure 2 It is a schematic diagram of the side structure of a preferred embodiment of a multilayer printed circuit board of the present invention, image 3 Yes figure 2 Schematic plan view of the copper foil layer shown. The multi-layer printed circuit board 2 includes a first copper foil layer 21 , a second copper foil layer 23 , a third copper foil layer 25 , a first heat-press layer 27 and a second heat-press layer 29 . The first copper foil layer 21, the second copper foil layer 23, and the third copper foil layer 25 are relatively spaced apart, and the first heat-pressed layer 27 is san...

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Abstract

The invention provides a multiplayer printed circuit board, comprising a first copper foil layer, a second copper foil layer, a third copper foil layer and hot pressing layers, wherein the first copper foil layer, the second foil layer and the third foil layer are oppositely arranged at intervals; each hot pressing layer is arranged between the adjacent copper foil layers; and the edge region of the surface at one side, adjacent to each hot pressing layer, of each copper foil layer comprises multiple choked flow bar structures, multiple grooves are arranged between the adjacent choked flow bars, and the grooves are communicated mutually. The invention also provides a manufacturing process of the multiplayer printed circuit board. The multiplayer printed circuit board and the manufacturing process thereof have the advantage of even thickness and to the circuit board has small possibility of cracking.

Description

technical field [0001] The present invention relates to the technical field of printed circuit boards (Printed Circuit Board, PCB), in particular to a multilayer printed circuit board and a manufacturing process thereof. Background technique [0002] Nowadays, the cost of printed circuit boards is gradually reduced, the degree of integration is gradually increased, and at the same time, it has many advantages such as more portability and versatility. Therefore, printed circuit boards currently occupy the high ground of many products in the industrialization era. [0003] Currently, a multilayer printed circuit board usually includes at least two copper foil layers and a PP layer (polypropylene resin layer) sandwiched between the copper foil layers. The PP layers are respectively sandwiched between every two adjacent copper foil layers, and the copper foil layers are bonded to form a multilayer printed circuit board. [0004] When making a multilayer printed circuit board w...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/00H05K3/46
Inventor 冉彦祥
Owner 东莞市五株电子科技有限公司