Discharge control device in assembly line of integrated circuit lead frame
A lead frame and integrated circuit technology, used in the manufacture of circuits, electrical components, semiconductor/solid-state devices, etc., can solve the problems of mold damage, lead frame damage, dragging to the ground, etc., to achieve the effect of convenient use and simple structure
Active Publication Date: 2012-03-07
顺德工业(江苏)有限公司
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Problems solved by technology
Since the unwinding speed of the leveling machine is difficult to keep consistent with the punching speed of the punching machine, when the unwinding speed is greater than the punching speed, the lead frame located between the straightening machine and the punching machine will be dragged to the ground due to being too long, causing the lead frame to be damaged. damage; when the feeding speed of the leveling machine is slower than the punching speed, since the lead frame cannot be fed smoothly, it will cause deformation of the produced integrated circuit lead frame and even cause damage to the mold
Method used
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Embodiment Construction
[0011] The discharge control device in the integrated circuit lead frame production line of the present invention will be further described in detail through specific embodiments below.
[0012] Such as figure 1 , figure 2 As shown, the discharge control device in the integrated circuit lead frame production line includes a base 6 and a fixed plate 1 arranged vertically on the base, and a U-shaped material guide plate 2 is provided on the side of the fixed plate 1 , the material guide plate 2 and the fixed plate 1 are perpendicular to each other, the bottom of the material guide plate 2 is provided with a discharge detector 3, the middle of the material guide plate 2 is provided with an end material detector 4, the discharge detector 3 and the end material detector The material detectors 4 are all communicated with the controller (not shown in the figure), and the leveler and punch press are all controlled by the controller. The base 6 is provided with a material retaining ...
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The invention relates to a discharge control device in an assembly line of an integrated circuit lead frame. The discharge control device comprises a base and a fixed board which is vertically arranged on the base; a U-type material guide board is arranged at the side part of the fixed board; the material guide board is vertical to the fixed board; a discharge photoelectric detector is arranged above the bottom part of the material guide board; a remained material photoelectric detector is arranged in the middle of the material guide board; the discharge photoelectric detector and the remained material photoelectric detector are both in communication connection with a punching machine and a leveler controller; and a discharge machine and the punching machine are both controlled by a controller. The discharge control device is arranged between the leveler and the punching machine in the assembly line of the integrated circuit lead frame, and can be used for controlling a discharge speed and a punching speed according to conditions of the assembly line, thereby preventing the die damage caused by the fact that the integrated circuit lead frame is damaged due to friction with the ground surface or deformed due to hitching and the materials are hitched when entering into the die.
Description
technical field [0001] The invention relates to a material discharging control device in an integrated circuit lead frame production line. Background technique [0002] When the integrated circuit lead frame is produced, the lead frame is punched and formed by a punching machine after being discharged by a leveler. Since the unwinding speed of the leveling machine is difficult to keep consistent with the punching speed of the punching machine, when the unwinding speed is greater than the punching speed, the lead frame located between the straightening machine and the punching machine will be dragged to the ground due to being too long, causing the lead frame to be damaged. damage; when the feeding speed of the leveling machine is slower than the stamping speed, the lead frame cannot be fed smoothly, which will cause deformation of the produced integrated circuit lead frame and even damage the mold. Contents of the invention [0003] The technical problem to be solved by t...
Claims
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IPC IPC(8): H01L21/48
Inventor 张林燕
Owner 顺德工业(江苏)有限公司