Casing-free double-piece type semiconductor lighting lamp structure

Abstract

The invention discloses a casing-free double-piece type semiconductor lighting lamp structure, which is characterized in that a heat conductor is arranged at the position of a lamp body, a light source is arranged on the surface of the heat conductor, omniseal technological processing is adopted by the light source of the heat conductor to enable the light source of the heat conductor to be exposed outside in all weather, passive heat dissipation is directly performed by utilizing the outside environment, the heat conductor is utilized to perform heat-conducting heat dissipation, and passive heat dissipation is performed between the outer surface of the heat conductor and the outside environment. The design conception can be applied to all the semiconductor lighting lamps, thereby being good in practicality and functionality. Individual design can be performed according to requirements of users, the beautifying effect of a whole product is improved, and accordingly market competitiveness of the product is improved. Compared with the prior art, the casing-free double-piece type semiconductor lighting lamp structure has the outstanding advantage of substantial innovation and remarkable progress.

Description

Technical field: [0001] The invention relates to the technical field of semiconductor lighting fixtures, in particular to a shellless two-piece semiconductor lighting fixture structure, in particular to its mechanical connection structure. Background technique: [0002] Comparative document, patent number: ZL200720073302.7, patentee: Li Jiansheng, application date: 2007.08.06, this case discloses an "integrated integrated LED semiconductor lamp", its structural features are: LED light source and cooling fins The structural metal shell, light distribution system and power supply form a five-in-one integrated solid-state integration. [0003] It cannot be seen from the above comparative documents that the existing semiconductor lighting fixtures are equipped with metal or non-metal casings. If the non-metal casing is easy to cause the heat of the light source to be difficult to dissipate, it is necessary to add an external large radiator device. If It is made of metal shell. ...

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Problems solved by technology

[0003] It cannot be seen from the above comparative documents that the existing semiconductor lighting fixtures are equipped with metal or non-metal casings. If the non-metal casing is easy to cause the heat of the light source to be difficult to dissipate, it is necessary to add an external large radiator device. If It is made of metal shell. Although it can conduct part of the heat through the outer surface, the heat conduction effect is not ideal. Because the light source of semiconductor lighting lamps generates a lot of heat, especially some high-power semiconductor lighting lamps, it is usually necessary to add an external Only large cooling devices can meet the heat dissipation rate. Such a design structure will increase the manufacturing cost of the lamp virtually. At the same time, too many lamp components will increase the difficulty of lamp assembly and reduce production efficiency. Moreover, the existing semiconductor lighting lamps The light sources are all built-in, and it is very inconvenient to replace the light source after it is damaged, which is not conducive to the daily maintenance of the lamps

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