Light-emitting diode (LED) wire welding device and wire welding method
A wire bonding device and wire bonding technology, applied in auxiliary devices, welding equipment, circuits, etc., can solve the problems of reducing the brightness reliability and service life of the chip, damage the chip, and high temperature, and achieve operability, oxidation prevention and control. Nitriding, the effect of increasing weldability
Inactive Publication Date: 2012-04-04
YICHANG JINSEN OPTRONICS TECH +1
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Problems solved by technology
The traditional LED welding wire temperature is high, and the long-term accumulation of high temperature on the LED chip will damage the chip, thereby reducing the brightness of the chip and the reliability and service life of the LED
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[0019] An LED wire welding device includes a welding head 5, a wire welding swing arm 6, a suction nozzle 7, a catheter 3 is fixedly connected to the wire welding swing arm 6 through a fixed arm 1, and a needle 4 is connected to the lower end of the catheter 3.
[0020] The upper end of the catheter 3 is connected with an airway joint 2,
[0021] A flow meter 8 is connected to one end of the airway joint 2 .
[0022] An LED wire bonding method includes the following steps: during the wire bonding process, the needle 4 and the suction nozzle 7 move together, and at the same time, the needle 4 ejects gas to protect the correspondingly welded LED chip 10 at the suction nozzle 7 .
[0023] During wire welding, the gold wire 9 passes through the suction nozzle 7, and the welding head 5 welds the gold wire 9 on the LED chip 10. The needle 4 and the suction nozzle 7 move together, and at the same time, the needle 4 sprays inert gas to protect the LED chip 10 welded at the suction ...
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The invention relates to a light-emitting diode (LED) wire welding device, which comprises a welding head, a wire welding swing arm and a suction nozzle, wherein a conduit is fixedly connected with the wire welding swing arm by a fixed arm; a needle head is connected to the lower end of the conduit; and a gas guiding tube joint is connected to the upper end of the conduit, and a flowmeter is connected to one end of the gas guiding tube joint. An LED wire welding method comprises the following steps that: the needle head and the suction nozzle are moved in the wire welding process, and gas sprayed from the needle head protects LED chips welded at the suction nozzle correspondingly. By the method, waste heat on the LED chips after wire welding can be better carried away by airflow to prevent the performance of the chips from being influenced and enhance the reliability of the LED chips; and the airflow also can prevent oxidation and nitridation effectively, enhance the welding performance and improve the welding quality effectively. The device has a simple structure and operability and is safe.
Description
technical field [0001] The invention relates to an LED packaging device and a process method, in particular to an LED wire bonding device and a wire bonding method. Background technique [0002] Under the theme of advocating low carbon, energy saving, and environmental protection around the world, and when lighting accounts for a large proportion of energy consumption, LEDs, as a new type of backlight and lighting source, have been constantly maturing and improving. LED packaging is an important part of LED production, which directly determines the performance of LEDs. The traditional LED bonding wire has a high temperature, and the long-term accumulation of high temperature on the LED chip will damage the chip, thereby reducing the brightness of the chip and the reliability and service life of the LED. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide an LED wire bonding device and a wire bonding method, which ar...
Claims
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IPC IPC(8): B23K3/00B23K3/08B23K101/40
Inventor 李超敬鑫清
Owner YICHANG JINSEN OPTRONICS TECH