Method for paving conductive gasket

Abstract

The invention discloses a method for paving a conductive gasket and is applicable to a portable computer which comprises an upper shell, a lower shell and a circuit board. The method comprises the following steps of: acquiring a clearance list according to a part combined chart file of the portable computer, wherein the clearance list comprises a plurality of clearance heights corresponding to a plurality of candidate positions; and each clearance height is a distance between an upper part and the upper shell of the circuit board or a distance between a lower part and the lower shell of the circuit board; selecting one of the clearance heights from the clearance list from small to large as a candidate clearance; judging whether the surface of a part corresponding to the candidate clearance is made of a conductive material; if the surface of the part corresponding to the candidate clearance is made of the conductive material, recording a paving mark at the candidate position corresponding to the candidate clearance; and paving the conductive gasket in the portable computer according to the paving mark.

Description

technical field [0001] The invention relates to a method for laying a conductive pad, in particular to a method for laying a conductive pad in a portable computer. Background technique [0002] Today, with the rapid development of science and technology, all kinds of electronic devices occupy a place in our daily life. In particular, portable electronic devices such as notebook computers, personal digital assistants, or e-book browsers are an indispensable part of modern people's lives. However, such electronic devices with sophisticated internal structures are prone to noise interference, for example, they may be interfered by electromagnetic waves or electrostatic discharges generated by other electrical appliances around them. Noise may cause abnormal operation of electronic devices; in severe cases, it may even cause damage to the device. [0003] In order to solve such problems, it is common practice to use components such as metal spring fingers, conductive gaskets o...

AI Technical Summary

Problems solved by technology

[0004] However, the current methods all need to manually judge the suitable laying of conductive pads, and then ask the mechanical engineer to mark the position on the component assembly diagram of the electronic device, and finally lay it by the operators on the production line

This method not only increases the cost due to the need for time-consuming human judgment and then marking the suitable laying position, but also lengthens the process and reduces the competitiveness of the manufacturer due to the need to go back and forth between different units such as antenna R&D personnel and institutional engineers

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