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Method for adhering island adhesive tape to flexible printed circuit

A flexible circuit board and adhesive tape technology, which is applied to printed circuits, printed circuit manufacturing, electrical components, etc., can solve the problems of low processing efficiency and easy sticking, so as to improve processing efficiency, improve accuracy, and facilitate repetition. effect used

Active Publication Date: 2013-05-22
无锡广芯封装基板有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the prior art, the complete tape is usually first punched / cut into the tape required for a single FPC finished unit, and then each punched / cut tape is aligned with a single FPC finished unit one by one, and pasted one by one. Relatively low efficiency and easy to stick

Method used

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  • Method for adhering island adhesive tape to flexible printed circuit
  • Method for adhering island adhesive tape to flexible printed circuit
  • Method for adhering island adhesive tape to flexible printed circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0048] Embodiments of the present invention provide a method for pasting an island-type tape on a flexible circuit board, so as to improve the processing efficiency and pasting accuracy of pasting the island-type tape on the flexible circuit board.

[0049] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0050] For example figure 1 As shown, for the scene where the tape pasting area is isolated (that is, the tape pasting area does not coincide with any side of the FPC finished unit), the tape is required to be pasted i...

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PUM

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Abstract

The embodiment of the invention discloses a method for adhering an island adhesive tape to a flexible printed circuit. The method comprises the following steps of: processing a positioning mark on an auxiliary material; processing the positioning mark on an adhesive tape, and punching part of the contour of the island adhesive tape; by using the positioning mark, overlapping the auxiliary material and the adhesive tape in a position matching mode; punching the rest of the contour of the island adhesive tape on the adhesive tape which is overlapped on the auxiliary material to obtain the island adhesive tape; and by using the positioning mark on the auxiliary material and the positioning mark on a processing unit of the flexible printed circuit to be subjected to adhesion of the island adhesive tape, overlapping the auxiliary material and the processing unit of the flexible printed circuit in the position matching mode to adhere the island adhesive tape which is attached to the auxiliary material to an adhesive tape adhesion area of a finished product unit in the processing unit of the flexible printed circuit. By adoption of the technical scheme provided by the embodiment of the invention, the efficiency and accuracy of adhesion of the island adhesive tape to the flexible printed circuit can be improved.

Description

technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to a method for sticking an island adhesive tape on a flexible circuit board. Background technique [0002] At present, there are various types of circuit boards on the market, FPC (Flexible Printed Circuit, flexible circuit board), also known as flexible circuit board or flexible circuit board, referred to as FPC. FPC is generally a printed circuit board with high reliability and excellent flexibility, which is made of polyester film or polyimide as the base material and formed on copper foil by etching. [0003] In the FPC production process, it is often necessary to stick tape to each FPC finished unit. [0004] see figure 1 , for the scene where the tape pasting area is isolated (that is, the tape pasting area does not coincide with any side of the FPC finished unit), the tape is required to be pasted inside the area of ​​the FPC finished unit, and cannot be attached...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
Inventor 熊佳杨智勤
Owner 无锡广芯封装基板有限公司
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