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Monolithic cold plate configuration

A technology of cold plate and monomer, applied in the direction of cooling/ventilation/heating transformation, electric solid-state devices, semiconductor devices, etc., which can solve time-consuming problems

Inactive Publication Date: 2012-05-09
HAMILTON SUNDSTRAND SPACE SYST INT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Current inspection techniques for measuring drill wander include ultrasound and x-ray inspection which, while effective, are time consuming and somewhat subjective

Method used

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  • Monolithic cold plate configuration
  • Monolithic cold plate configuration
  • Monolithic cold plate configuration

Examples

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Embodiment Construction

[0024] Figure 1A A cold plate assembly 20 is shown schematically. As disclosed herein, cold plate assembly 20 is a redundant fluid monolithic cold plate assembly that provides structural rigidity and may be fabricated from, for example, an aluminum alloy. It should be understood that other structures having deep hole drilling channels may additionally benefit from this disclosure.

[0025] The cold plate assembly 20 generally includes a plate 22 having a first inlet port 24-1 and a second inlet port 24-2 that communicate fluid to respective first inlet fluid manifolds 26-1 and second inlet fluid manifolds 26-1 Manifold 26-2. Fluids are conveyed through respective inlet fluid manifolds 26-1, 26-2 and then into respective first and second fluid paths 28-1, 28-2, first and second fluid paths 28-1, 28-2 28 - 2 extends transverse to inlet fluid manifolds 26 - 1 , 26 - 2 and across plate 22 . From the first fluid path 28-1 and the second fluid path 28-2, fluid is collected in th...

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Abstract

The invention relates to a monolithic cold plate configuration, in particular, a cold plate assembly includes a monolithic cold plate which defines a trough located to intersect a fluid path.

Description

[0001] Statement Regarding Federal Sponsorship of Research and Development [0002] This invention was made with Government support through the National Aeronautics and Space Administration under Contract No. NNJ06TA25C. Accordingly, the Government has certain rights in this invention. technical field [0003] The present disclosure relates to heat transfer devices, and more particularly to cold plate assemblies. Background technique [0004] The operation of high-speed electronic components such as microprocessors, graphics processors, and other modules generates heat that needs to be removed in order to operate efficiently. Heat removal provides, for example, cooler operating temperatures, higher operating speeds, greater computing power, and greater reliability. [0005] A cold plate (cooling plate) is a liquid-cooled structure with many closely spaced fluid channels that provide a heat transfer function to the components mounted to it. For relatively long cold plates,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/473H05K7/20
CPCF28F3/12H01L23/473F28F9/026H01L2924/0002Y10T29/4935H01L2924/00
Inventor M. A. 扎菲蒂M. B. 劳林
Owner HAMILTON SUNDSTRAND SPACE SYST INT
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