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Bonding apparauts and bonding method

A technology of bonding device and holding part, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as airtightness damage, easy generation of voids in wafers, etc., and achieve the effect of preventing voids

Inactive Publication Date: 2014-11-05
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, it is presumed that the airtightness due to the close contact between the upper chuck and the lower chuck is impaired at the position corresponding to the bolt 103, and voids are likely to be generated on the wafer in the vicinity of this position.

Method used

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  • Bonding apparauts and bonding method
  • Bonding apparauts and bonding method
  • Bonding apparauts and bonding method

Examples

Experimental program
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Embodiment Construction

[0038] Next, embodiments of the present invention will be described. figure 1 It is a vertical cross-sectional view showing a schematic configuration of the bonding apparatus 1 of the present embodiment.

[0039] The bonding apparatus 1 includes a lower chuck 10 serving as a first holding unit that places and holds a lower wafer W serving as a first thin plate member on the upper surface. L ; As the upper chuck 11 of the second holding part, it adsorbs and holds the upper wafer W as the second thin plate member on the lower surface U . The upper chuck 11 is disposed above the lower chuck 10 so as to face the lower chuck 10 . Thus, the lower wafer W held on the lower chuck 10 L with the upper wafer W held on the upper chuck 11 U relatively. In addition, in this embodiment, the lower wafer W L The diameter and upper wafer W U of the same diameter.

[0040] A pressing mechanism 12 for pressing the upper chuck 11 vertically downward is provided on the upper surface of the...

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PUM

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Abstract

A bonding apparatus has an upper chuck and a lower chuck for holding wafers. The upper chuck is configured such that the center portion is bent to be convex when pressurized with a predetermined pressure. On the bottom surface of the lower chuck, there is an insulating ring formed of a combination of a plurality of insulating members to support the periphery of the lower chuck. The bottom surface of the insulating ring is supported by a support ring formed of a combination of a plurality of supporting members. The supporting members and the lower chuck are fixed by a bolt provided for each of the supporting members. The bolt is inserted through a through hole and a through hole which are formed in the insulating members and the supporting members, respectively, the through holes having a diameter larger than a diameter of the bolt.

Description

technical field [0001] The present invention relates to a bonding device for bonding two thin-plate members together and a bonding method using the bonding device. Background technique [0002] In recent years, for example, in the field of manufacturing semiconductor devices and MEMS (Micro Electro Mechanical Systems: Micro Electro Mechanical Systems), the increase in diameter of semiconductor wafers (hereinafter referred to as “wafers”) has been promoted. In addition, in specific processes such as mounting, wafer thinning is required. However, for example, when a large-diameter thin wafer is directly transported or polished, the wafer may be warped or cracked. Therefore, in order to reinforce a wafer, the wafer is bonded to a reinforcing substrate, for example, another wafer of the same shape and size. Typically, bonding of the wafers is performed using an adhesive. [0003] However, when an adhesive is used to bond a wafer to another wafer, air may enter between the waf...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67092H01L21/67H01L21/683
Inventor 秋山直树杉山雅彦大森阳介
Owner TOKYO ELECTRON LTD