Thin film for fast selecting failed crystal grains from wafer and use method
A thin-film and wafer technology, used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of wasting resources and manpower, inability to guarantee accuracy, and consuming a lot of time and manpower, saving costs and facilitating operations. Effect
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[0026] The film for rapidly selecting failed grains on the wafer in this embodiment is a transparent film made of PVC (polyvinyl chloride), with a thickness of 0.1-1 mm.
[0027] Since the wafer used in this embodiment is an 8-inch wafer, a square film of 200mm×200mm is used.
[0028] The film is marked with a coordinate system such as figure 1 As shown, the coordinate system corresponds to the test coordinate system on the wafer, wherein the grain size on the wafer is 1mm×1mm, and the coordinate grid size on the film is designed to be 1mm×1mm. In addition, there are alignment marks on the film for alignment with the wafer, such as figure 1 The notch shown in is marked mark1, and the left and right borders are marked mark2.
[0029] The method of using the above thin film will be described below by taking the failed grain coordinates (x=12, y=14) tested on the wafer as an example. The method specifically includes steps:
[0030] (1) Use a marker pen to mark the point (x=12...
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Abstract
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