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Thin film for fast selecting failed crystal grains from wafer and use method

A thin-film and wafer technology, used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of wasting resources and manpower, inability to guarantee accuracy, and consuming a lot of time and manpower, saving costs and facilitating operations. Effect

Active Publication Date: 2013-12-18
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This process is time-consuming, and if there are thousands or tens of thousands of dies on the wafer, it will take a lot of time and manpower to select one of the failed dies;
[0006] Third, the accuracy cannot be guaranteed. In the process of counting, all the grains are repeated, and it is easy to count the wrong rows and columns. Performing failure analysis on the wrong number of failed grains will waste a lot of precious resources. and manpower

Method used

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  • Thin film for fast selecting failed crystal grains from wafer and use method
  • Thin film for fast selecting failed crystal grains from wafer and use method
  • Thin film for fast selecting failed crystal grains from wafer and use method

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Embodiment Construction

[0026] The film for rapidly selecting failed grains on the wafer in this embodiment is a transparent film made of PVC (polyvinyl chloride), with a thickness of 0.1-1 mm.

[0027] Since the wafer used in this embodiment is an 8-inch wafer, a square film of 200mm×200mm is used.

[0028] The film is marked with a coordinate system such as figure 1 As shown, the coordinate system corresponds to the test coordinate system on the wafer, wherein the grain size on the wafer is 1mm×1mm, and the coordinate grid size on the film is designed to be 1mm×1mm. In addition, there are alignment marks on the film for alignment with the wafer, such as figure 1 The notch shown in is marked mark1, and the left and right borders are marked mark2.

[0029] The method of using the above thin film will be described below by taking the failed grain coordinates (x=12, y=14) tested on the wafer as an example. The method specifically includes steps:

[0030] (1) Use a marker pen to mark the point (x=12...

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Abstract

The invention discloses a thin film for fast selecting failed crystal grains from a wafer and a use method. The thin film is made of an insulating material and has transparent nature. A coordinate system is marked on the thin film and is corresponding to a test coordinate system on the wafer. The use method of the thin film comprises the following steps of: 1) marking a mark on a corresponding coordinate of the thin film according to the coordinate of the failed crystal grain tested on the wafer; 2) aligning the wafer by utilizing the coordinate system and an alignment mark of the thin film and pasting the thin film on the wafer; and 3) throwing off the thin film so that the mark of the corresponding coordinate of the thin film is transferred to the wafer. With the adoption of the thin film for fast selecting the failed crystal grains from the wafer and the use method, the failed crystal grains can be accurately and time-savingly found out from the wafer, and great convenience is brought for the work of selecting the failed crystal grains.

Description

technical field [0001] The invention relates to a thin film and a use method thereof, in particular to a thin film for rapidly selecting a failed die on a wafer and a use method thereof. Background technique [0002] In the failure analysis process of integrated circuits in the factory (FAB), the key step is how to select the failed die from the wafer according to the test coordinates. However, in practical applications, the following problems will be encountered: [0003] First, for the failed wafers in the secondary screening (CP2), if the dots have already been printed, you can use the point-to-point method to find the failed dies, but there is only one color for the dots. If the distribution of failed dies is relatively dense, find out Targeting grains will be more difficult. [0004] For wafers with severe primary screening (CP1) failure, the secondary screening will not be tested, and dots will not be tested, making it even more difficult to find the target die. If ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/66
Inventor 马香柏
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP