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Substrate-bonding device and method and substrate bonding head

A technology for bonding devices and substrates, applied in lamination devices, chemical instruments and methods, and assembling printed circuits with electrical components, etc., can solve problems such as wiring breakage and breakage, and achieve the effect of improving reliability and preventing product failures

Inactive Publication Date: 2015-07-08
TORAY ENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the above-mentioned stress occurs, it may lead to product failures such as breakage of wiring, breakage, peeling of joint surfaces, etc.

Method used

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  • Substrate-bonding device and method and substrate bonding head
  • Substrate-bonding device and method and substrate bonding head
  • Substrate-bonding device and method and substrate bonding head

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0062] Regarding the mode for carrying out the present invention, while using the attached Figure 1 side to explain.

[0063] [Device structure]

[0064] figure 1 It is a perspective view which shows an example of embodiment of this invention.

[0065] figure 2 It is a front view showing main structural devices of an example of the embodiment of the present invention.

[0066] In each figure, let the three axes of the rectangular coordinate system be X, Y, and Z, let the XY plane be the horizontal plane, and let the Z direction be the vertical direction. In particular, the Z direction represents upward with the direction of the arrow, and downward with its opposite direction.

[0067] The substrate bonding apparatus 1 is configured to include a stage unit 2 , a head 3 , a tray conveyance unit 4 , a coating unit unit 5 , a curing unit unit 6 , a balloon head unit 7 , and a control unit 9 .

[0068] The stage unit 2 is configured to include an X1-axis stage 21 mounted on...

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PUM

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Abstract

Disclosed is a device that positions a first substrate , which has a wiring / electrode pattern formed on the surface thereof, and a second substrate, which has a wiring / electrode pattern formed on the surface thereof, such that the wiring / electrode patterns on the substrates face each other, and then bonds the substrates together. The disclosed device is provided with: a means for holding the second substrate; a means for bending the held second substrate; and a means for bringing the first substrate and the second substrate close to each other, one of said substrates being coated with a curable resin, and pressing the second substrate towards the first substrate. The disclosed device and method minimize the amount of curable resin coating while preventing the incorporation of voids and increasing the contact area between opposing wiring / electrode patterns with respect to the comparatively large total surface area of the substrates on which wiring / electrode patterns are formed.

Description

technical field [0001] The present invention relates to a substrate bonding apparatus and method for bonding substrates having wiring electrode patterns formed on their surfaces together using curable resin. Background technique [0002] Devices and methods for mounting semiconductor chips and substrates on which electronic circuits are formed on substrates on which wiring electrode patterns are formed have been widely used. Furthermore, in recent years, with the narrowing of the pitch of the wiring electrode patterns on the above-mentioned semiconductor chips and substrates, sufficient strength cannot be ensured only in the soldering of the electrode joint part, so the use of hardening resin is poured into the periphery of the joint part and cured. An underfill construction method to improve joint strength. [0003] Advances in narrower pitches of wiring electrode patterns require high mounting accuracy, and on the other hand, the above-mentioned semiconductor chips and su...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H05K3/36
CPCB32B37/0015B32B2457/08B32B2310/08H05K2203/068H05K3/361H05K3/305B32B37/1207H01L24/81H03K3/36H05K3/363H05K3/4614
Inventor 寺田胜美
Owner TORAY ENG CO LTD
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