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Method for preparing perchlorovinyl conductive adhesive dried quickly at room temperature

A technology of vinyl perchloride and conductive adhesive, used in conductive adhesives, adhesives, epoxy resin adhesives, etc., can solve the problems of high curing temperature, multi-component packaging, slow drying speed, etc., to achieve high chemical stability, The effect of long storage period and easy construction

Inactive Publication Date: 2013-05-08
LANZHOU PETROCHEM COLLEGE OF VOCATIONAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above-mentioned conductive adhesives have some shortcomings in terms of conductivity, construction, storage stability and cost, such as multi-component packaging, high curing temperature, slow drying speed, etc.

Method used

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  • Method for preparing perchlorovinyl conductive adhesive dried quickly at room temperature

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] (1) Synthetic resin

[0039] Add 100 parts of castor oil, 100 parts of glycerin, 70 parts of rosin, 10 parts of maleic anhydride, 80 parts of phthalic anhydride, 1 part of lead oxide, and 20 parts of xylene into the reaction kettle, and react for 6 hours at 220 ° C. Dilute 200 parts of solvent (butyl acetate:toluene=1:1 (v / v)) to solid content 55±5%, acid value ≤25mgKOH / g, viscosity 1~20s / Grignard tube 25°C, cool, Filter to obtain synthetic resin for use.

[0040] (2) Preparation of modified silver-coated copper powder

[0041] a. Preparation of main salt solution: AgNO 3 Dissolve in water to form a 0.3mol / L solution, add AgNO under stirring 3 2~3 times the molar amount of NH 3 h 2 O, complete reaction forms transparent silver ammonia solution;

[0042] Preparation of reducing solution: Dissolve glucose in water to form a 0.3mol / L solution, then add stabilizer polyethylene glycol, and stir evenly.

[0043] b. Electroless silver plating

[0044] First wash th...

Embodiment 2

[0052] (1) Synthetic resin

[0053] Add 100 parts of flax oil, 100 parts of pentaerythritol, 20 parts of benzoic acid, 80 parts of phthalic anhydride, 1.5 parts of LiOH, and 30 parts of xylene into the reaction kettle, and react for 8 hours at 200 ° C. =1:1 (v / v)) 200 parts diluted to solid content 50±5%, acid value ≤25mgKOH / g, viscosity 1~20s / Grignard tube 25°C, cooled and filtered to obtain synthetic resin. use.

[0054] (2) Preparation of modified silver-coated copper powder

[0055] a. Preparation of main salt solution: AgNO 3 Dissolve in water to form a 0.1mol / L solution, add AgNO under stirring 3 2~3 times the molar amount of NH 3 h 2 O, complete reaction forms transparent silver ammonia solution;

[0056] Preparation of reduction solution: Dissolve formaldehyde in water to form a 0.5mol / L solution, then add stabilizer polyethylene glycol, and stir evenly.

[0057] b. Electroless silver plating

[0058] First wash the copper powder with acetone to remove oil, t...

Embodiment 3

[0066] (1) Synthetic resin

[0067] With 100 parts of castor oil, 70 parts of pentaerythritol, 40 parts of diethylene glycol, 601 # 10 parts of epoxy resin, 10 parts of benzoic acid, 15 parts of maleic anhydride, 100 parts of phthalic anhydride, and 40 parts of xylene were added to the reaction kettle and reacted for 10 hours at 190°C. :1) Dilute 100 parts until the solid content is 75±5%, the acid value is ≤25mgKOH / g, the viscosity is 1~20s / Grignard tube at 25°C, cooled and filtered to obtain a synthetic resin for use.

[0068] (2) Preparation of modified silver-coated copper powder

[0069] a. Preparation of main salt solution: AgNO 3 Dissolve in water to form a 0.2mol / L solution, add AgNO under stirring 3 2~3 times the molar amount of NH 3 h 2 O, complete reaction forms transparent silver ammonia solution;

[0070] Preparation of reducing solution: Dissolve tartrate in water to form a 0.25mol / L solution, then add stabilizer polyethylene glycol, and stir evenly.

[00...

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Abstract

The invention discloses a method for preparing a perchlorovinyl conductive adhesive dried quickly at room temperature, and belongs to the technical field of chemical industry. According to the method, the conductive adhesive which is prepared by taking vinyl chloride resin as a main film-forming matter, synthetic resin as reinforced modified resin and silver covered copper conductive powder as a conductive agent overcomes the defect that the copper powder in a copper conductive adhesive is exposed in air to be oxidized easily so electrical conductivity is reduced, and the cost of the conductive adhesive is far lower than that of pure silver while the electrical conductivity of the conductive adhesive reaches the standard of that of the pure silver; the conductive adhesive is packaged in asingle-component mode, is dried quickly at the room temperature and is easy and convenient to construct, and industrial automatic bonding is easy to realize; and the conductive adhesive also has the characteristics of long storage period, and the like and can be recycled, is mainly used for conductive bonding, repair, fixing, sealing and conductive coating among various electronic circuits, amongelectronic elements, among metals, between metals and nonmetals and among nonmetals at non-stressed parts and also can be used for bonding samples in scanning electron microscopes so as to obtain high-definition images and the like.

Description

technical field [0001] The invention belongs to the technical field of chemical industry and relates to a preparation method of perchlorethylene conductive adhesive, in particular to a preparation method of room temperature fast-drying perchlorethylene conductive adhesive. Background technique [0002] Conductive adhesive is an adhesive with certain conductivity after curing or drying. It is usually composed of matrix resin and conductive filler. The conductive particles are bonded together through the matrix resin and dried at a suitable curing temperature to form a film. Pathway to realize the conductive connection of the adhered material. According to the curing temperature, it can be divided into room temperature curing conductive adhesive, medium temperature curing conductive adhesive, high temperature curing conductive adhesive, UV curing conductive adhesive, etc.; according to the direction of conduction, it can be divided into isotropic conductive adhesives (ICAs) an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J127/24C09J167/08C09J163/00C09J11/04C09J9/02
Inventor 伍家卫吕维华唐蓉萍杨兴锴陈淑芬索陇宁甘黎明吴海霞王有朋杨智吕江平王雪香
Owner LANZHOU PETROCHEM COLLEGE OF VOCATIONAL TECH