Light-emitting diode illuminating device using diamond-like-film-copper composite materials for radiating
A diamond-like film and light-emitting diode technology, applied in the field of LED inventions, can solve the problems of heat dissipation of LED lighting devices, and achieve the effects of reducing brightness, shortening service life, and enhancing heat conduction
Inactive Publication Date: 2014-04-09
SOUTH CHINA NORMAL UNIVERSITY
View PDF2 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0003] The technical problem to be solved by the present invention is to overcome the heat dissipation problem of the existing LED lighting device, and provide a light-emitting diode lighting device using a diamond-like film-copper composite material as a heat sink
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0029] Referring to FIG. 1 to FIG. 3 , the present invention provides a preferred embodiment of an LED lighting device using a diamond-like copper composite material as a heat sink, but the embodiment of the present invention is not limited thereto.
[0030] like Figure 1a As shown: the LED 5 is directly placed on the upper surface of the heat dissipation substrate 1 made of diamond powder and copper powder composite material at the center through the crystal-bonding glue 4 . The heat dissipation substrate 1 is a diamond-like copper composite material, and the heat dissipation substrate 1 is composed of copper 12 and a diamond-like carbon film 11 on its upper surface and lower surface. There is a circuit layer 3 above the heat dissipation substrate 1 . There are holes in the center of the circuit layer 3, and the positions of the holes correspond to the positions of the LED5. The circuit layer 3 supplies the external current to the LED5 through the pin 53 . Above the circui...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
Login to View More
Abstract
The invention discloses a light-emitting diode illuminating device using diamond-like-film-copper composite materials for radiating, which comprises a light-emitting diode (LED) (5), a reflection cup (6) and a radiating baseboard (1) made of the diamond-like-film-copper composite materials, wherein the lower surface of the radiating baseboard (1) is directly contacted with the air, the LED (5) is directly installed on the upper surface of the radiating baseboard (1) through solid crystal glue (4) or metal eutectic solder, and a circuit layer (3) is arranged on the upper surface of the radiating baseboard (1) and provided with a hole for the LED (5) to penetrate through. The light-emitting diode illuminating device adopts the diamond-like-film-copper composite materials, extracts heat from the large-power LED within the shortest path, and directly dissipates heat to the air, thereby being capable of effectively reducing thermal resistance, simultaneously giving consideration to light-emitting characteristics, and being simple in structure and easy to manufacture.
Description
technical field [0001] The invention relates to the technical field of LED inventions, in particular to a light-emitting diode lighting device using a diamond-like film-copper composite material as a heat sink. Background technique [0002] Liquid crystal display, indoor lighting, street lamps, and automobile lamps are currently popular areas for LED lamp applications. However, these applications either require LEDs to be arranged densely, or require high input current, and require stable operation under long-time lighting conditions. About 85% --- 90% of the electrical energy is converted into heat energy, so the problem of LED heating becomes significant in these application fields. If the heat dissipation problem is not solved, there will be two main effects: (1) the luminous brightness is weakened, and (2) the service life is attenuated. At present, the commonly used aluminum substrates, copper substrates, co-fired ceramics and system circuit boards cannot satisfactoril...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/64
Inventor 姚光锐范广涵郑树文张涛龚长春许毅钦贺龙飞
Owner SOUTH CHINA NORMAL UNIVERSITY