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Preparation method of modified wood-plastic composite filled with waste circuit board nonmetal powder

A technology for wood-plastic composite materials and waste circuit boards, which is applied in the field of preparation of non-metal powder-filled modified wood-plastic composite materials for waste circuit boards, can solve problems such as lack of economic means, environmental pollution, waste of useful resources, etc., and achieve overall improvement. performance, simple reaction steps, and the effect of improving interfacial bonding properties

Inactive Publication Date: 2012-06-27
TONGJI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the recycling technology of metal materials in waste circuit boards in the recycling process of waste circuit boards is relatively mature, and some technologies have been commercialized. In addition, there is still a lack of effective economic means, and a large part of non-metallic materials are discarded, incinerated or buried as garbage, which not only causes serious environmental pollution, but also leads to a large waste of useful resources.

Method used

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  • Preparation method of modified wood-plastic composite filled with waste circuit board nonmetal powder
  • Preparation method of modified wood-plastic composite filled with waste circuit board nonmetal powder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Example 1: Wood powder is modified by silane coupling agent KH550 to obtain surface-active wood powder; water is used as liquefaction solution and sulfuric acid is used as catalyst to perform hydrothermal activation treatment on non-metallic powder of waste circuit boards to obtain The non-metallic powder of waste circuit boards activated by hydrothermal method; the wood powder modified by the coupling agent obtained above, the non-metallic powder of waste circuit boards activated by hydrothermal method and polyethylene are mechanically mixed and mixed in parallel and in the same direction Extruding and forming in a screw extruder to obtain a wood-plastic composite material modified by non-metallic powder filling of waste circuit boards.

[0022] Step (1): Weigh 200g of dry wood powder, immerse the dry wood powder in the silane coupling agent KH550 solvent at 40°C for 1 hour, take it out, and dry it at 60°C for 2 hours to obtain surface-coupled Wood powder modified by c...

Embodiment 2

[0028] Example 2: Wood powder is modified by silane coupling agent KH560 to obtain surface active wood powder; water is used as liquefaction solution and potassium hydroxide is used as catalyst to carry out hydrothermal activation treatment on non-metallic powder of waste circuit boards, Obtain the non-metallic powder of waste circuit boards activated by hydrothermal method; the wood powder modified by the coupling agent obtained above, the non-metallic powder of waste circuit boards activated by hydrothermal method and polypropylene are mixed mechanically in parallel Extrude into a twin-screw extruder to obtain a wood-plastic composite material modified by non-metal powder filling of waste circuit boards.

[0029] Step (1): Weigh 300g of dry wood powder, immerse the dry wood powder in the silane coupling agent KH560 solvent at 50°C for 2 hours, take it out, and dry it at 70°C for 2 hours to obtain surface-coupled Wood powder modified by chemical agent;

[0030] Step (2): Add...

Embodiment 3

[0034] Example 3: Wood powder is modified by silane coupling agent KH570 to obtain surface-active wood powder; water is used as liquefaction solution and potassium carbonate is used as catalyst to perform hydrothermal activation treatment on non-metallic powder of waste circuit boards to obtain The non-metallic powder of the waste circuit board activated by the hydrothermal method; the wood powder modified by the coupling agent obtained above, the non-metallic powder of the waste circuit board activated by the hydrothermal method and polyvinyl chloride are mixed mechanically in parallel Extrude into a twin-screw extruder to obtain a wood-plastic composite material modified by non-metal powder filling of waste circuit boards.

[0035] Step (1): Weigh 400g of dried wood powder, immerse the dried wood powder in the silane coupling agent KH570 solvent at 60°C for 1 hour, take it out, and dry it at 80°C for 3 hours to obtain surface-coupled Wood powder modified by chemical agent; ...

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Abstract

The invention relates to a preparation method of a modified wood-plastic composite filled with waste circuit board nonmetal powder. The preparation method comprises the following steps: modifying wood flour through coupling agent to obtain surface active wood flour; carrying out hydrothermal method activation processing on dried waste circuit board nonmetal powder to obtain activated waste circuit board nonmetal powder; mechanically mixing the surface active wood flour, the activated waste circuit board nonmetal powder and thermoplastic resin; and extrusion molding the mixture in a parallel homodromous double-screw extruder to obtain the modified wood-plastic composite filled by the waste circuit board nonmetal powder. According to the method, the reaction steps are simple, the interfacial adhesion performance of the wood flour and resin matrix can be effectively improved, the interfacial adhesion strength of the composite is improved, a chemical bond of the nonmetal powder can be broken, new activating points can be generated so as to enable the waste circuit board nonmetal powder to generate new activating groups, and the aim of improving the interface binding property of the waste circuit board nonmetal powder and the resin matrix is achieved, so that the overall performance of the composite is improved.

Description

technical field [0001] The invention belongs to the technical field of comprehensive utilization of solid waste, in particular to a method for preparing a modified wood-plastic composite material filled with non-metallic powder of waste circuit boards. Background technique [0002] At present, the recycling technology of metal materials in waste circuit boards in the recycling and disposal of waste circuit boards is relatively mature, and some technologies have been commercialized. In addition, there is still a lack of effective economic means, and a large part of non-metallic materials are discarded, incinerated or buried as garbage, which not only causes serious environmental pollution, but also leads to a large waste of useful resources. Non-metallic materials in waste circuit boards generally account for more than 60%, and the main components are glass fiber and thermosetting epoxy resin. If these materials can be fully utilized, it can not only relieve the pressure of w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J11/14C08J11/16C08L97/02C08L63/00C08K7/14B29C47/92B29C48/92
CPCB29C48/40B29C48/92B29C2948/9259B29C2948/92704B29C2948/92885B29C2948/92895
Inventor 邱军李启胜王宗明
Owner TONGJI UNIV