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High-power LED assembly with optical structure

An optical structure, high-power technology, applied in the direction of light source, electric light source, light source fixed, etc., can solve the problem of high price, achieve the effect of solving the problem of heat dissipation, reducing the overall cost and reducing the cost

Inactive Publication Date: 2012-06-27
XIAN FUAN INNOVATION CONSULTATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the prices of existing LED lamps are very high

Method used

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  • High-power LED assembly with optical structure
  • High-power LED assembly with optical structure
  • High-power LED assembly with optical structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Such as figure 1 As shown, the high-power LED assembly with an optical structure includes: a base body 1, the base body 1 is an aluminum substrate, and there are lamp holes 2 with fixedly distributed LED chips 5 on the aluminum substrate, and there is an electrode on the top surface of the LED chip on the side of the lamp hole 2 Bonding point 7, point the conductive glue 4 at the bottom of the lamp hole, fix the electrode at the bottom of the LED chip 5 through the conductive glue 4, connect the electrode on the top surface of the LED chip 5 to the bonding point 7 through the bonding wire 6, and print on the upper surface of the aluminum substrate The wiring of the board making, the wiring makes the distributed LED chips form a series connection, the LED chips 5 distributed on the aluminum substrate are integrally encapsulated with transparent epoxy resin 10, so that the integrally encapsulated transparent epoxy resin 10 forms the optical window of the LED. The size of ...

Embodiment 2

[0019] same as figure 1 As shown, the high-power LED assembly with an optical structure includes: a base body 1, the base body 1 is an aluminum substrate, and there are lamp holes 2 with fixedly distributed LED chips 5 on the aluminum substrate, and there is an electrode on the top surface of the LED chip on the side of the lamp hole 2 Bonding point 7, lamp hole 2 is fixed with lamp cup 9 through adhesive layer 3, conductive adhesive 4 is inserted into the bottom of lamp cup 9, the electrode at the bottom of LED chip 5 is fixed through conductive adhesive 4, and the top surface of LED chip 5 is connected to the top surface of LED chip 5 through bonding wire 6 The electrode to the bonding point 7, the upper surface of the aluminum substrate has the wiring of the printed board, the wiring makes the distributed LED chips form a series connection, and the LED chips 5 distributed on the aluminum substrate are encapsulated with transparent epoxy resin 10 as a whole, so that the whole...

Embodiment 3

[0021] Such as figure 2 As shown, the high-power LED assembly with an optical structure includes: a base body 1, the base body 1 is an aluminum substrate, and there are lamp holes 2 with fixedly distributed LED chips 5 on the aluminum substrate, and there is an electrode on the top surface of the LED chip on the side of the lamp hole 2 Bonding point 7, point the conductive glue 4 at the bottom of the lamp hole, fix the electrode at the bottom of the LED chip 5 through the conductive glue 4, connect the electrode on the top surface of the LED chip 5 to the bonding point 7 through the bonding wire 6, and print on the upper surface of the aluminum substrate The wiring of the board, the wiring makes the distributed LED chips form a series connection, the LED chips 5 distributed on the aluminum substrate are sealed by the lens 11, and there is a sealed vacuum nozzle 12 on the aluminum substrate, after vacuuming with the sealed vacuum nozzle 12 Carry out sealing treatment. The len...

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PUM

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Abstract

The invention relates to LED lamps, in particular to a high-power LED assembly with an optical structure, which comprises a base and LED lamp chips fixed on the same. The high-power LED assembly is characterized in that the base is an aluminum substrate provided with distributed LED lamp chip holes, an LED chip top electrode bonding spot is reserved on one side of each LED lam chip hole, conductive paste is dripped to the bottom of each hole to fasten a lower electrode of the corresponding LED lamp chip, wires of a printed circuit board are arranged on the upper surface of the aluminum substrate, and the LED chips are serially connected through the wires. Transparent epoxy resin is hermetically filled onto the whole distributed LED chips on the aluminum substrate, so that the whole hermetically filled transparent epoxy resin forms an optical window with LEDs.

Description

technical field [0001] The invention relates to an LED lamp, especially a high-power LED aggregate with an optical structure. Background technique [0002] The chip of the existing high-power LED lamp is above 45mil, and the working current is 300mA. When the working voltage is 3V, the power should be 1W. The 45mil power of 1W needs good heat dissipation to ensure that it works within the design parameters. Therefore, the quality of heat dissipation directly affects the life of high-power LED lamps. Generally, when the ambient temperature of an LED is around 20 degrees, the normal working junction temperature is around 60 degrees. When an LED with a diameter of 5mm has an operating current of 20mA, the junction temperature is around 60 degrees, which can achieve the purpose of long life of the LED. 45mil power and 1W junction temperature will not work for too long without good heat dissipation. [0003] There are two structures for 3-5W LED lamps, one is to use 1-3 high-po...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V29/00F21V19/00F21V23/06F21Y101/02F21V29/503F21V29/70
Inventor 刘珉恺
Owner XIAN FUAN INNOVATION CONSULTATION