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Method for preparing nano/micron crystal composite structure pure copper

A composite structure and micro-crystalline technology, applied in the direction of nanotechnology, can solve the problems of material plasticity or toughness reduction, hindering dislocation movement, etc., and achieve the effect of reducing plasticity and simple process

Inactive Publication Date: 2012-07-04
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the basic strengthening methods of materials mainly include: strain strengthening, solid solution strengthening, phase transformation strengthening, grain refinement strengthening and second phase dispersion strengthening, etc. The essence of these strengthening techniques is to introduce various defects (points, Line, surface body defects) to hinder dislocation movement and improve material strength, but these traditional strengthening techniques will significantly reduce the plasticity or toughness of the material

Method used

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  • Method for preparing nano/micron crystal composite structure pure copper
  • Method for preparing nano/micron crystal composite structure pure copper
  • Method for preparing nano/micron crystal composite structure pure copper

Examples

Experimental program
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example 1

[0008] Example 1: The specific implementation conditions are shown in Table 1.

[0009] Table 1 specific implementation conditions and results

[0010]

example 2

[0011] Example 2: The specific implementation conditions are shown in Table 2.

[0012] Table 2 specific implementation conditions and results

[0013]

example 3

[0014] Example 3: The specific implementation conditions are shown in Table 3.

[0015] Table 3 specific implementation conditions and results

[0016]

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Abstract

The invention relates to a method for preparing nano / micron crystal composite structure pure copper, belonging to the field of the preparation technology of metal material. According to the method, a pulse power supply is adopted in the electrodeposition process, the current density is 20-28A / dm<2> in the electrifying stage, and the positive duty ratio is 12-25%; an anode and a cathode are inserted into electrolyte in parallel, wherein the anode is pure copper, and the cathode is stainless steel; and the electrolyte comprises the component of 460-510g / L of copper sulfate, and additive comprises the component of 62-70g / L of saccharin. In the deposition process, stirring is carried out, and the stirring speed is 60-80r / min; and the deposition is carried out at the constant temperature of 50-58 DEG C for 30min-2h, and copper sulfate solution is supplemented in the electrodeposition process. The nano / micron crystal composite structure material is obtained, and the problem that the plasticity of the material is reduced when the strength of the material is improved is solved.

Description

technical field [0001] The invention belongs to the technical field of metal material preparation, and provides a method for preparing a metal material with a nano / micro crystal composite structure, thereby improving the comprehensive strength and toughness of the metal material. Background technique [0002] Strengthening of metal materials has been a core research direction in the field of materials for a long time. At present, the basic strengthening methods of materials mainly include: strain strengthening, solid solution strengthening, phase transformation strengthening, grain refinement strengthening and second phase dispersion strengthening, etc. The essence of these strengthening techniques is to introduce various defects (points, Line, surface body defects) to hinder dislocation movement and improve material strength, but these traditional strengthening techniques will significantly reduce the plasticity or toughness of the material. Taking fine-grain strengthening...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D5/18B82Y40/00
Inventor 范爱玲黄浪张姗
Owner BEIJING UNIV OF TECH