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Electroplating apparatus and process for wafer level packaging

A kind of equipment and plating technology, applied in circuits, electrolytic components, electrolytic processes, etc., can solve the problem of high cost and achieve substantial cost savings

Active Publication Date: 2012-07-04
NOVELLUS SYSTEMS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] While meeting each of these challenges, the WLP electrofill process must manage to overcome conventionally less challenging but potentially costly pick and place (e.g., solder ball placement) or screen printing operations

Method used

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  • Electroplating apparatus and process for wafer level packaging
  • Electroplating apparatus and process for wafer level packaging
  • Electroplating apparatus and process for wafer level packaging

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0068] Tin - 160g / l to 240g / l

[0069] silver-none

[0070] Acid - 40g / l to 140g / l acid (based on methanesulfonic acid (MSA))

[0071] Organic Additives - None

example 2

[0073] Tin-230g / L

[0074] silver-none

[0075] Acid - 80g / L, as MSA

[0076] Organic additives:

[0077] Ishihara TS202-AD (grain refining additive) available from Ishihara Chemical Co., Ltd. (Ishihara Chemical Co., LTD.) in Kobe, Japan: 40 g / L

[0078] Can be purchased from Ishihara TS-SLG (silver complexing agent)-200g / L of Ishihara Chemical Co., Ltd. (Ishihara Chemical Co., LTD.) in Kobe, Japan

[0079] In Example 2, the anolyte contained organic additives. In typical operation of the apparatus provided herein, a portion of the anolyte is directed from the anode chamber to the cathode chamber via a fluid conduit other than the separator. This flow of anolyte to catholyte is important in maintaining the balance of the plating bath and is called cascade flow, while the addition of anolyte to catholyte is called cascade flow ( cascading). Thus, the anolyte containing the plating additive flows cascaded to the cathode chamber, where the plating additive improves the elec...

example 3

[0082] Tin: 230g / L (tin methanesulfonate)

[0083] Acid: 50g / L (for methanesulfonic acid)

[0084] Silver: no

[0085] Additives: None

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Abstract

The invention relates to an electroplating apparatus and a process for wafer level packaging. An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of Sn-Ag alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use.

Description

[0001] Cross References to Related Applications [0002] This application asserts the prior U.S. Provisional Application for Mayer et al. Application Serial No. 61 / 418,781 and the previous U.S. provisional U.S. provisional patent application filed June 29, 2011 entitled "ELECTRODEPOSITION WITH ISOLATED CATHODE AND REGENERATED ELECTOLYTE" listing Mayer as an inventor To the benefit of Application No. 61 / 502,590, each of the foregoing applications is incorporated by reference in its entirety and is hereby incorporated for all purposes. technical field [0003] The present invention relates to methods and apparatus for the simultaneous electrodeposition of two metals having substantially different standard electrodeposition potentials. In particular, the present invention relates to methods and apparatus for the simultaneous electrodeposition of tin and silver for wafer level packaging applications. Background technique [0004] Electrochemical deposition processes are well ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D21/12C25D3/30C25D3/46C25D17/00C25D5/10
CPCC25D17/001C25D21/12C25D21/14C25D7/123C25C1/20C25C7/00C25D3/56C25D3/46C25D3/30C25D17/002C25D3/60C25D5/022C25D17/00C25D5/10C25D21/18C25D5/48
Inventor 史蒂文·T·迈尔戴维·W·波特
Owner NOVELLUS SYSTEMS