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Wick material for heat sink device for electronic component, heat sink device and preparation method of heat sink device

A technology for heat dissipation devices and electronic components, applied in indirect heat exchangers, lighting and heating equipment, cooling/ventilation/heating transformation, etc., can solve the problems of insufficient hydrophilic performance, complicated process, low controllability, etc. Excellent thermal performance, simple manufacturing process, good hydrophilic performance

Active Publication Date: 2015-05-20
CHANGDE LYRUN MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Copper powder sintering has a low yield rate due to its complex process and low controllability, and the one-time investment of copper powder sintering equipment is large
As a liquid-absorbing core, copper mesh has insufficient hydrophilic properties due to its material structure characteristics, which limits the heat transfer efficiency of the vapor chamber

Method used

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  • Wick material for heat sink device for electronic component, heat sink device and preparation method of heat sink device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] The heat pipe liquid-absorbing core material used for heat dissipation of electronic components is three-dimensional porous. 3 .

[0015] Select a sponge substrate with a thickness of 3.0 mm and a pore size of 600 μm, roughen it with potassium permanganate solution, remove the film with oxalic acid, sensitize it with stannous chloride, and activate it with palladium to perform electroless copper plating. After electroless copper plating, copper is electroplated in a copper plating solution with copper pyrophosphate and potassium pyrophosphate as the main salts. The copper plating solution contains 60g / L copper pyrophosphate, 350g / L potassium pyrophosphate, and oxygen-free copper as the anode. Electroplated copper 800g / m 2 , After electroplating, the products are cleaned and then subjected to high temperature heat treatment. Then the porous copper is rolled to a thickness of 1.5mm according to the thickness of the heat pipe. The pore diameter is 300μm, the thickness ...

Embodiment 2

[0017] Put the liquid-absorbing core material of Example 1 into the tubular shell, and then support the liquid-absorbing core material on the inner wall of the shell with a bracket, then vacuumize the inside of the tube, inject pure water and seal it, and then the heat pipe can be produced.

Embodiment 3

[0019] Vapor absorbing core material for heat dissipation of electronic components, in three-dimensional porous shape, the holes communicate with each other, the diameter of the hole is 50μm, the thickness of the liquid absorbing core material is 0.5mm, and the volume density range of metal copper is 1.6g / cm 3 .

[0020] Select a sponge substrate with a thickness of 2.0 mm and a pore size of 200 μm, and make the substrate conductive by coating conductive glue. Copper is then electroplated in a copper sulfate copper plating solution. The copper plating solution contains copper sulfate 100g / L, sulfuric acid 100ml / L, and chloride ion 80mg / L acidic copper plating solution, with phosphor copper as the anode, and electroplated copper 800g / m 2 , After electroplating, the products are cleaned and then subjected to high temperature heat treatment. Then the porous copper material is rolled to a thickness of 0.5 mm according to the thickness of the vapor chamber. The pore diameter is ...

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Abstract

The invention provides a wick material for a heat sink device for an electronic component. The wick material is three-dimensional porous metal copper, pores are intercommunicated, the diameter of the pores ranges from 10 mu m to 900 mu m, the thickness of the pores ranges from 0.1 to 10.0mm, and volume density of the metal copper ranges from 0.1 to 2.0g / cm<3>. The invention also provides a method for manufacturing the heat sink device by using the wick material, and the heat sink device. The wick material has high hydrophilic property, and the heat sink device manufactured by the wick material has excellent heat dissipation property; and meanwhile, the preparation process of the heat sink device is simple, and the heat sink device is low in cost.

Description

technical field [0001] The invention relates to an electronic component accessory material, an accessory and a preparation method, in particular to a liquid-absorbing core material for a heat dissipation device, a heat dissipation device and a preparation method. Background technique [0002] With the development of electronic technology, some electronic components are made smaller and smaller, with higher power, higher heat density, and higher requirements for heat dissipation. If the heat cannot be dissipated in time, it will seriously affect the performance and life of the chip. Heat pipes and vapor chambers are commonly used radiators. With efficient heat transfer capabilities, the heat from the heat source is quickly transferred to the heat sink to dissipate heat in time, which can effectively reduce the temperature of the chip of the electronic component, thereby improving the performance of the electronic component and improving the use. life. The liquid-absorbing c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20F28D15/02
Inventor 陈晓智蒋素斌黎林峰周小平
Owner CHANGDE LYRUN MATERIAL