Supercharge Your Innovation With Domain-Expert AI Agents!

Trimming method for ceramic slab of surface mount device and apparatus thereof

A technology for a chip component and a ceramic embryonic body is applied in the field of a trimming method for a ceramic embryonic body of a chip component and its device, which can solve the problems of high cost, no effective solution, complicated equipment structure and the like, and achieves the use of The effect of prolonging life, simple structure and reducing cost

Inactive Publication Date: 2015-05-20
SHENZHEN SUNLORD ELECTRONICS
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the cylinder drives the platen to rotate, the movement speed of the cylinder is susceptible to a slight difference due to the change of the compressed air volume. When the pneumatic device is moving at a low speed, the low-speed stability of the cylinder is not stable because the friction force accounts for a relatively large proportion of the thrust. Well, it affects the accuracy and consistency of trimming the embryo body, and the equipment structure is complex and expensive
The above two problems have a great impact on the efficiency and quality of product processing, and the two have not been effectively resolved so far

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Trimming method for ceramic slab of surface mount device and apparatus thereof
  • Trimming method for ceramic slab of surface mount device and apparatus thereof
  • Trimming method for ceramic slab of surface mount device and apparatus thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] The present invention will be further described below with reference to accompanying drawing:

[0025] Such as figure 1 As shown, an edge trimming device for a chip-type ceramic body includes a knife-mounted fixture 1 and a blade 2. The blade 2 has four pieces in total, and a group of two pieces is divided into two groups, which are arranged at a certain distance and installed on On the bottom surface 3 of the knife mounting fixture 1, the two blades 2 in each group are parallel to each other, and the adjacent two groups are perpendicular to each other; the trimming device also includes a movable table for carrying the chip-type ceramic body plate and the drive unit that controls the tool fixture 1, the movable table includes two processing stations, which can be moved to the corresponding positions of the blades 2 in each group.

[0026] Such as figure 2 and image 3 As shown, the trimming device has a protective sheath 4 covering the blade 2, the protective sheath...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a trimming apparatus for the ceramic slab of a surface mount device, including: a movable bedplate, a tool clamp, more than three blades arranged on the tool clamp, and a driving unit for driving the tool clamp. The invention also provides a trimming method for the ceramic slab of a surface mount device; blades arranged on the tool clamp sequentially and intermittently work in groups to complete the trimming of the ceramic slab of a surface mount device. The application of the trimming apparatus and method in the invention prolongs the service life of blades and reduces the operation of the equipment, so that the structure of the apparatus is simpler, the cost is lower, and the accuracy and consistence of trimming are improved.

Description

technical field [0001] The invention relates to the field of chip components, in particular to a trimming method and device for a ceramic body of a chip component. Background technique [0002] SMD components are widely used in electronic products, which is the most obvious feature of the development and application of modern electronic technology. [0003] At present, in the process of processing SMD components, the trimming device of the ceramic body mainly uses one or two blades, the cylinder drives the platen to rotate, and the cutter cuts down. Continuous work, the wear of the blade is too fast, and the service life is greatly shortened. When the cylinder drives the platen to rotate, the movement speed of the cylinder is susceptible to a slight difference due to the change of the compressed air volume. When the pneumatic device is moving at a low speed, the low-speed stability of the cylinder is not stable because the friction force accounts for a relatively large prop...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B28B11/12
Inventor 祝小清黄德林曾艳军田志飞杨平
Owner SHENZHEN SUNLORD ELECTRONICS
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com