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Spd films and light valve laminates with improved bus-bar connections

A technology of suspended particle devices and connectors, which is applied in the fields of conductive adhesive connection, optics, nonlinear optics, etc.

Active Publication Date: 2012-07-18
RES FRONTIERS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This cost is very high, because the SPD film, hot melt adhesive film and glass substrate are all useless

Method used

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  • Spd films and light valve laminates with improved bus-bar connections
  • Spd films and light valve laminates with improved bus-bar connections
  • Spd films and light valve laminates with improved bus-bar connections

Examples

Experimental program
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Effect test

Embodiment

[0036] sample preparation

[0037] Method 1: Silver-containing EPO-TEK epoxy resin system (place bus bars first, then cure). First, two epoxy components, Part A and Part B, were mixed in a 1:1 ratio in a suitable container at room temperature, and a thin layer of this mixture was applied on the ITO-PET electrode. A conductive copper foil or conductive fabric (bus bars) is placed on top of the thin layer of epoxy mixture and pressed lightly to ensure that the conductive layer fully contacts the epoxy mixture. Careful attention was paid to prevent any uncontacted areas or air bubbles between the conductive layer and the silver-containing epoxy mixture, which would significantly reduce bond strength and possibly cause an open circuit. Finally, the samples were left at room temperature for at least 24 hours or at higher temperatures for a shorter time to fully cure the epoxy mixture. Prior to use, the samples were checked for conductivity with an Ohmmeter to ensure they were p...

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PUM

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Abstract

A connection between a power bus and a conducting layer of a suspended particle device in accordance with an embodiment of the present application includes an adhesive combined with metallic particles to impart both good adhesion and electrical conductivity. The adhesive is applied to a surface of the conducting layer. A conducting copper foil or conducting fabric is adhered to the adhesive and forms at least a portion of the power bus.

Description

[0001] Cross References to Related Applications [0002] This application claims U.S. Provisional Patent Application Serial No. 61 / 256,836, filed October 30, 2009, entitled "SPD FILMS AND LIGHT VALVE LAMINATES WITH IMPROVED BUS BAR CONNECTIONS IMPROVED BUS-BAR CONNECTIONS), the entire contents of which applications are hereby incorporated by reference. technical field [0003] The present invention relates to films and laminates of films for use in light valves containing liquid particle suspensions. Light valves are generally referred to herein as suspended particle devices or SPD light valves, or simply SPDs. More specifically, the present invention relates to improved bus-bars for such SPD films, which provide enhanced adhesion of the bus-bar material to electrodes incorporating SPDs. Background technique [0004] The use of SPD light valves in light regulation has been known for over seventy years. During that period such light valves have been proposed for use in man...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
CPCH01R4/04Y10T156/10G02F1/172G02F1/1341G02F1/13458
Inventor 王东燕S·M·斯洛瓦克R·L·萨克斯
Owner RES FRONTIERS