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COF (chip on film) packaging unit and COF packaging winding tape

A baseband and circuit chip technology, applied in the field of liquid crystal display, to achieve the effect of increasing economic benefits, saving procurement costs, and improving equipment utilization

Inactive Publication Date: 2012-07-25
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a COF packaging unit and packaging tape suitable for large-size liquid crystal panels produced with existing COF baseband materials.

Method used

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  • COF (chip on film) packaging unit and COF packaging winding tape
  • COF (chip on film) packaging unit and COF packaging winding tape
  • COF (chip on film) packaging unit and COF packaging winding tape

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Embodiment Construction

[0019] The present invention will be further described below in conjunction with the drawings and preferred embodiments.

[0020] Such as figure 2 As shown, the structure of the COF packaging unit packaged in tape and reel (TAB) includes: a COF baseband 1, a circuit chip packaged on the COF baseband 1, 2, a circuit chip 2 and input terminals and output terminals (not shown in the figure) ) The connected input terminal wiring 3 and output terminal wiring 4, the input terminal and output terminal (not shown in the figure) are respectively arranged on the two cut edges 7 of the COF baseband 1. Such as image 3 Shown are the technical solutions proposed by the present invention, and figure 2 The difference in the prior art shown is that the input terminal wiring 3 and the output terminal wiring 4 are respectively arranged along the edge of the COF baseband 1, that is, the input terminals and output terminals are respectively arranged along the edge of the COF baseband 1, and the in...

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Abstract

The invention discloses a COF (chip on film) packaging unit and a COF packaging winding tape. The COF packaging unit comprises a COF base tape, a circuit chip, an input end wire and an output end wire, wherein the circuit chip is packaged on the COF base tape, and the input end wire and the output end wire are connected with the circuit chip and are provided with input terminals and output terminals respectively at two edges of the COF base tape. The input terminals and the output terminals are distributed along the edges of the COF base tape, the length of the COF packaging unit can be set according to needs of the input end wire and the output end wire, so that the COF base tape has sufficient area for wiring so as to be applicable to needs of large-size liquid crystal panel, resources are integrated and utilized reasonably, equipment utilization rate is increased, purchase cost of materials is saved and economic benefits are increased.

Description

Technical field [0001] The invention relates to the field of liquid crystal display, and more specifically, to a COF packaging unit and a COF packaging tape. Background technique [0002] COF (Chip On Film, chip soft film packaging technology) technology is widely used in the field of liquid crystal display; it is usually mounted on the driver of the liquid crystal display device for packaging circuit chips (IC Die). [0003] The COF produced by the tape and reel (TAB) package is taped and fed in a roll, such as figure 1 As shown, the COF base tape 1 is wound in a reel 101, and the reel 101 performs tape feeding. The encapsulated COF structure is as figure 2 As shown, the COF packaging structure includes: a COF baseband 1, a circuit chip encapsulated on the COF baseband 1, an input terminal wiring 3 and an output terminal that connect the circuit chip 2 with input terminals and output terminals (not shown in the figure) The wiring 4, the input terminal and the output terminal (no...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/13H01L23/498H01L21/50
CPCH01L2924/0002H01L23/4985H01L21/50H01L24/97H01L23/498G02F1/13H01L2924/14H01L2924/00
Inventor 廖良展林柏伸毕育欣
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD