LED sealing structure with high heat dissipation effect and sealing method thereof

Abstract

The invention discloses an LED sealing structure with a high heat dissipation effect and a sealing method thereof. The sealing method for realizing the sealing structure comprises the following steps of cleaning, first time of activation, second time of activation, coverage of a seal ring, growth of solder, pre-sealing and laser heating, after a surface activation treatment, an LED element and a sample are combined closely, and laser local sealing of the LED element and a substrate can be realized without external pressure. According to the invention, required equipment is simple, only specific region is in partial high temperature, bonding is realized, high bonding strength and wettability are provided, a device at a low temperature on the whole, unnecessary temperature gradient and stress field distribution are not generated, a deficiency that the product performance of a sealed LED element is affected due to temperature increment in a work process, and heat dissipation capability of the LED component is raised remarkably at the same time.

Description

technical field [0001] The invention relates to LED sealing technology, in particular to an LED packaging structure with good heat dissipation effect and a packaging method thereof, which is applicable to direct sealing of multiple LED light-emitting chips. Background technique [0002] Since light-emitting diodes are high-efficiency cold light-emitting elements that can convert electrical energy into light energy, and have the advantages of low power consumption and long life, light-emitting diodes are mostly used for indication purposes in electronic products. But how to use LEDs for commercial and home lighting or decoration still has a lot of space to be filled. [0003] Taiwan's new patent I229948 discloses a flip-chip LED packaging array and its packaging unit. It mainly discloses that a LED chip is arranged on a ceramic substrate and connected to the metal wiring layer on the ceramic substrate; the ceramic substrate is made of Thermally conductive adhesive is attache...

AI Technical Summary

Problems solved by technology

[0004] At present, more and more researchers are working on LED sealing by using surface activation treatment and fused external auxiliary field strength, but they all need to be heated on the whole device or substrate, which will cause unnecessary stress and The temperature field distribution, and the above-mentioned sealing technology is not easy to achieve selective bonding, and the bonding area and heat-affected zone are difficult to control

At the same time, there is still a lot of room for improvement in the automation of traditional single-chip packaging. It is also very important to greatly improve the light output efficiency of LEDs on the basis of solving heat dissipation problems.

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