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Method for improving stability of bonding strength of adhesive interface

A technology of interface bonding and adhesives, applied in the direction of adhesives, bonding methods, adhesive types, etc., can solve the problems of low bonding strength of objects, low bonding strength, uneven thickness of adhesive layer, etc., to ensure consistency , to ensure stability, to ensure the effect of uniformity and stability

Inactive Publication Date: 2013-10-09
STATE GRID CORP OF CHINA +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] During product research and production, it was found that since the construction process of Great Wall 730 adhesive is mainly manual brushing, the thickness of the applied adhesive layer is uneven, and Great Wall 730 adhesive needs to be diluted with solvent during construction, and sometimes the solvent is not fully volatilized , the above factors lead to unstable bonding strength
It is mainly reflected in that in large-scale mass production, although the bonding surface of the objects is relatively small, the batch size is large, resulting in a certain number of objects with low bonding strength, which affects the stability of the batch quality; some objects are not in large batches , but the bonding surface of the object is very large, and the bonding strength of some individual parts is low, which affects the quality of the entire object

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A method for improving the stability of adhesive interface bonding strength, mainly comprising the following steps:

[0020] 1) Regulating steps: the ambient temperature of the bonded objects is controlled at 20°C, and the humidity is controlled at 45%;

[0021] 2) Glue compounding step: weigh the Great Wall 730 adhesive according to the mass ratio A:B=1:3, A is 100g, B is 300g, mix, stir evenly, and the color is red;

[0022] 3) Dilution step: Add chemically pure ethyl acetate to the adhesive for dilution. The amount of ethyl acetate is 3 times the mass of the adhesive, which is 1200g. Add in two times, add 400g for the first time, mix and stir evenly, and then add the rest 800g ethyl acetate, mix well;

[0023] 4) Brushing steps: Apply adhesive on the bonding surface of the object, wait for the ethyl acetate to volatilize, touch the bonding surface with your fingers, if there is no adhesion with your fingers, apply the adhesive again on the bonding surface, and brush...

Embodiment 2

[0028] A method for improving the stability of adhesive interface bonding strength, mainly comprising the following steps:

[0029] 1) Regulating steps: the ambient temperature of the bonded objects is controlled at 23°C, and the humidity is controlled at 55%;

[0030] 2) Glue compounding step: weigh Great Wall 730 adhesive according to the ratio of mass ratio A:B=1:5, A is 100g, B is 500g, mix, stir evenly, and the color is red;

[0031] 3) Dilution step: Add chemically pure ethyl acetate to the adhesive for dilution. The amount of ethyl acetate is 4 times the mass of the adhesive, which is 2400g. Add in two times, and add the same amount for the first time, which is 600g. Mix evenly. Then add the remaining 1800g, mix and stir evenly;

[0032] 4) Brushing steps: Apply adhesive on the bonding surface of the object, wait for the ethyl acetate to volatilize, touch the bonding surface with your fingers, if there is no adhesion with your fingers, apply the adhesive again on the b...

Embodiment 3

[0036] A method for improving the stability of adhesive interface bonding strength, mainly comprising the following steps:

[0037] 1) Regulating steps: the ambient temperature of the bonded objects is controlled at 25°C, and the humidity is controlled at 65%;

[0038] 2) Glue compounding step: weigh Great Wall 730 adhesive according to the ratio of mass ratio A:B=1:4, A is 100g, B is 400g, mix, stir evenly, the color is red;

[0039] 3) Dilution step: Add analytically pure ethyl acetate to the adhesive for dilution. The amount of ethyl acetate is 4 times the mass of the adhesive, which is 2000g. Add in two times, and add the same amount for the first time, which is 500g, and mix well. Then add the remaining 1500g, mix and stir evenly;

[0040] 4) Brushing steps: Apply adhesive on the bonding surface of the object, wait for the ethyl acetate to volatilize, touch the bonding surface with your fingers, if there is no adhesion with your fingers, apply the adhesive again on the b...

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PUM

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Abstract

The invention provides a method for improving the stability of the bonding strength of an adhesive interface, belongs to the field of an adhesive, improves a construction process of a Changcheng 730 adhesive, completes the process control and improves the stability of large-batch production and the bonding strength of large objects. The technical scheme disclosed by the invention mainly comprises a regulating step, a glue preparation step, a diluting step, a coating step and a bonding step; and ethyl acetate is chemically pure or analytically pure. With the adoption of the technical scheme, the bonding between metal and a rubber material which takes acrylonitrile-butadiene rubber as a substrate material, and the bonding of the rubber material which takes the acrylonitrile-butadiene rubber as the substrate material are carried out; the large-scale batch production of objects with smaller bonding surfaces and the batch production of objects with larger bonding surfaces are realized; a test result and a detection result show that the bonding strength is high and the batch quality stability is good; and the very good technical effect is obtained.

Description

technical field [0001] The invention belongs to the field of adhesives, and in particular relates to a method for improving the stability of adhesive interface bonding strength. Background technique [0002] The main function of the adhesive is to join the materials being bonded together. There are two main forms of bonding: nonstructural and structural. Non-structural bonding mainly refers to surface bonding, sealing and functional bonding, including adhesives for surface bonding, sealing and conductive adhesives, etc.; structural bonding is the bonding of structural units firmly fixed together with adhesives Phenomenon. The structural adhesive and its bonding points used in it must be able to transmit structural stress without affecting its structural integrity and applicability to the environment within the design range. Compared with traditional mechanical fastening, the stress transfer in the bonded component has a more uniform stress distribution, and the bonded com...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J5/00C09J109/02C09J161/06C08J5/12
Inventor 陈科基张磊欧阳樟李卫平崔琳邹德荣
Owner STATE GRID CORP OF CHINA
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