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Nonaqueous solvent system chemical nickel plating solution, and preparation method and application thereof

An electroless nickel plating, non-aqueous solvent technology, applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problem of difficulty in obtaining uniform and stable plating, increasing the cost of electroless nickel plating, and a large number of pinholes on the surface of the plating and other problems, to achieve the effect of convenient preparation, low price and uniform size

Inactive Publication Date: 2012-09-12
SHANGHAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003]1. During the deposition process, while the nickel ions are reduced to metal nickel, the reducing agent reacts with water to produce a large amount of hydrogen gas, which causes a large number of needles on the surface of the coating It is difficult to obtain a uniform and stable coating due to defects such as holes;
[0004]2. The high temperature environment consumes a lot of energy, and it is easy to decompose the plating solution, and the quality of the plating layer decreases;
[0005]3. A large amount of phosphite ions or borate ions will be produced, causing the aging of the plating solution and the quality of the coating will decline accordingly. If the aging solution is not handled properly, it will inevitably give The environment brings pollution, and the process will lose a lot of useful components, such as Ni2+, H2PO2- and complexing agents , buffering agent, etc., greatly increasing the cost of electroless nickel plating;
However, up to now, there is no process of applying the deep eutectic solvent system to electroless nickel plating.

Method used

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  • Nonaqueous solvent system chemical nickel plating solution, and preparation method and application thereof
  • Nonaqueous solvent system chemical nickel plating solution, and preparation method and application thereof
  • Nonaqueous solvent system chemical nickel plating solution, and preparation method and application thereof

Examples

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Effect test

Embodiment 1

[0041] The preparation method of the non-aqueous solvent system electroless nickel plating solution of the present embodiment comprises the steps of: mixing dry choline chloride and ethylene glycol in a molar ratio of 1:1, heating and melting at 80°C, and obtaining after melting and cooling The liquid is the deep eutectic solvent. After the main salt of nickel chloride hydrate is dissolved in the deep eutectic solvent, Ni can be prepared. 2+ A non-aqueous solvent system electroless nickel plating solution with a concentration of 25g / L.

[0042] When plating the substrate to be plated, the substrate to be plated is pretreated in advance. In this embodiment, the pure copper substrate is used as the substrate to be plated, and the 10×20mm pure copper substrate is polished-degreasing-alkali washing-water washing-acid washing- After water washing-acetone washing-air drying treatment, then immerse in the electroless nickel plating solution of the example, implement electroless nicke...

Embodiment 2

[0050] At 80°C, dry choline chloride and ethylene glycol are heated, mixed and melted at a molar ratio of 1:2 to form a deep eutectic solvent as a solvent. Use nickel chloride hydrate as the main salt to prepare Ni 2+ The concentration is the plating solution of 25g / L. At 50, 60, 70, 80, and 90°C, electroless nickel plating was performed on pure copper substrates for 24h. The base pure copper substrate and its pretreatment methods are the same as those in Example 1.

Embodiment 3

[0055] At 80°C, heat, mix and melt dry choline chloride and 1,3 butanediol at a molar ratio of 1:2 to form a deep eutectic solvent as a solvent. Nickel nitrate is the main salt, and the preparation of Ni 2+ The concentration of the plating solution is 25g / L, and the wetting agent polyethylene glycol concentration is 0.5g / L. Under the condition of 60°C, electroless nickel plating was carried out on the pure copper substrate for 12h. The base pure copper substrate and its pretreatment methods are the same as those in Example 1. As a result, a bright silver-white pure metal nickel coating was obtained on the surface of the pure copper substrate with a film thickness of 30 microns.

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Abstract

The invention discloses a nonaqueous solvent system chemical nickel plating solution, a preparation method and application thereof. The chemical nickel plating solution is formed by dissolving nickel salt in a deep eutectic solvent. The concentration of the nickel salt as the main salt solute of the solvent is 5-100g / L. The deep eutectic solvent is a nonaqueous solvent formed by mixing choline compound and polyol at a molar ratio of 1:0.1-10. The polyol has reducibility. The chemical nickel plating solvent of the invention only uses the choline compound and polyol type nonaqueous solvent as the solvent, and the nickel salt as the main salt, thereby having the advantages of simple composition and convenient preparation. Metal particles on the surface of a prepared chemical nickel plating layer has uniform size and are uniformly distributed. The choline compound employed as a raw material is biodegradable and is low in cost. Reaction speed is accelerated through reducing reaction temperature for reducing of metal ionics by the polyol. The nonaqueous solvent system chemical nickel plating solution and the preparation method thereof have the advantages of environmental protection low energy consumption.

Description

technical field [0001] The invention relates to a non-aqueous solvent system chemical nickel plating solution, its preparation method and its application in chemical nickel plating. Background technique [0002] Since Brenner and Riddle invented the electroless nickel plating technology in 1946, it has been widely used because of its uniform thickness, low porosity, and ability to deposit on non-metals. The traditional electroless nickel plating method is usually to obtain a nickel coating under high temperature conditions in an aqueous solution containing nickel salt, under the action of reducing agents such as hypophosphite, sodium borohydride, and hydrazine. The traditional electroless nickel plating technology in water system mainly has several shortcomings: [0003] 1. During the deposition process, while nickel ions are reduced to metallic nickel, the reducing agent reacts with water to produce a large amount of hydrogen gas, which causes a large number of pinholes an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/32
Inventor 鄢浩王文敏何志强
Owner SHANGHAI UNIV