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Metal heat-conduction enhanced floor

A technology of heat conduction enhancement and heat conduction plate, which is applied in the field of floor, heat transfer and heat pipe, can solve the problems of small heat transfer area between the floor heating pipe and the floor, difficulty in ensuring the surface contact heat exchange state, and the use of a large amount of keel and floor heating pipes, etc., to achieve Optimized mechanical properties, firm and smooth connection, precise and firm fit

Inactive Publication Date: 2012-09-12
叶丽英
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The distance between the keels of this scheme is only the width of the floor, and too many keels and floor heating pipes are used; too many slots on the floor of the two-layer structure greatly reduce the mechanical strength, which affects the use and costs materials; metal materials are not very suitable for "hot pressing process" Connected with wood; the heat transfer area between the floor heating pipe and the floor is small, and the floor is easily deformed due to the inconvenience of no groove and hammer nails, and the non-fixed connection between the floor heating pipe and the floor makes it difficult to guarantee the surface contact heat exchange state between the two ; The overall strength of the keel with holes and slots is reduced, and it is easy to crack during installation

Method used

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  • Metal heat-conduction enhanced floor
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  • Metal heat-conduction enhanced floor

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Experimental program
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Effect test

Embodiment Construction

[0038] Figure 1 to Figure 4 The first embodiment of the present invention is given together.

[0039] Figure 1 to Figure 4 Here, the heat medium pipes 1 are evenly arranged in parallel, passing through the plug-in connection interface 4 of the metal heat conducting plate 3 on the floor 2, and are connected and circulated with the external hot water source through the water inlet and outlet pipes to input heat energy for the heating system.

[0040] The metal heat-conducting plate 3 on the lower surface of the ground plate 5 wraps the ground plate 5 from both sides with a rim 6 to realize a low thermal resistance connection with the ground plate 5. The metal heat-conducting plate 3 and the ground plate 5 are also connected with the nails 7 through silica gel bonding. The nails 7 are nailed into the floor panel 5 from the bottom edge and the encapsulation 6 of the metal heat conducting plate 3. The curled edge of the hemming 6 is facing inward. The upper boundary of the encapsula...

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Abstract

A ground panel 5 is wrapped with a side wrapper 6 from two sides by a metal heat-conducting plate 3 arranged under the ground panel 5, and is connected with the metal heat-conducting plate 3 at low thermal resistance. The metal heat-conducting plate 3 and the ground panel 5 are further bonded by silica gel and connected in a low thermal resistance manner by using a nail-shaped member 7. A plurality of plug-in type connection interfaces 4 are in welded connection with a lower surface of the metal heat-conducting plate 3. The interfaces 4 are arranged in width direction of a floor 2, and have two guide edges 8 arranged in parallel and an arcuate surface 9 matching with heating medium pipelines 1. The guide edges 8 are matched and connected with a semi-coating plug-in type heat transfer sheet 10 to coat the heating medium pipelines 1. According to the invention, a drop of 5-10 DEG C of heat-transfer temperature from the heating element to the ground panel can be reduced, a reduction of more than 20% of the heating power can be achieved, and the thermal resistance of a dry heating floor can be reduced to an ideal degree. A keel-arranged floor has the advantages of comfortable feeling, sophisticated manufacturing processes, and convenient construction and maintenance.

Description

Technical field [0001] The invention relates to flooring, heat transfer and heat pipe technology. Background technique [0002] The keel solid wood floor feels comfortable. The use of underfloor heating can obtain a comfortable temperature gradient in the lower heating and upper cooling room, and is suitable for using the heat energy below 50℃ provided by solar collectors and heat pump units. [0003] The existing wet heating floor is provided with an insulating layer on the floor, and the concrete with embedded heating pipes is laid on the insulating layer, and the floor slab is laid on the concrete. The heated concrete radiates heat into the room through the floor slab. The wet heating floor has large thermal inertia, the structural layer takes up more space, the walking comfort is low, the maintenance is difficult, and the wooden floor panel is easy to deform. For this reason, a dry floor without concrete is proposed. The dry heating floor with hot water exposes the heat med...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04F15/02E01C11/26F24D15/00
Inventor 施国樑
Owner 叶丽英