UV-LIGA (Ultraviolet-Lithografie, Galvanoformung, Abformung) method for manufacturing multi layers of mini-type inductance coils on silicon substrate
A UV-LIGA and inductive coil technology, which is applied in the manufacture of circuits, electrical components, semiconductors/solid-state devices, etc., can solve the problems of affecting the electrical performance of coils, long production cycle of photographic substrates, and low cost performance, so as to improve production efficiency, Shorten the preparation period and design simple and convenient effects
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[0030] Detailed description of the specific implementation of the present invention in conjunction with the drawings and technical solutions
[0031] The process flow of the present invention is as follows figure 1 As shown, the specific steps are as follows:
[0032] 1) Draw a mask pattern and make each layer of coil mask according to the designed inductor coil shape, size and layout. Choose a chromium plate. Each layer of coil needs a pattern (chromium in the shading area and no chromium in the light transmission area). The two negative masks are respectively used for the positive resist lithography in the sputtering stage and the negative resist lithography in the electroforming stage (the photosensitive characteristics of the positive and negative photoresist are opposite). The wire column between the coils and the insulating layer before the metal as the seed layer, so only the negative mask is needed for the negative photolithography in the electroforming stage;
[0033] 2) Ch...
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