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Power distribution mounting part and inverter device using power distribution mounting part

A technology for installing components and inverters, which is applied in the direction of circuit devices, cable installation, printed circuit components, etc., can solve problems such as insulation damage and long-term reliability decline of inverter devices, and achieve high reliability.

Inactive Publication Date: 2015-12-09
HITACHI LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] However, if a conventional bus bar using such a thinned insulating layer (refer to Figure 10 , 11 ) If a higher voltage (such as 500V or more) is applied between the thick layer conductors, the problem of insulation breakdown will occur in a relatively short period of time.
In other words, there is a problem that the long-term reliability of the inverter device as a whole decreases
[0012] On the other hand, thickening the insulating layer 102 or the adhesive layer 103 in order to ensure the voltage resistance of the bus bar is contrary to the requirement of low inductance, so it is not preferable.

Method used

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  • Power distribution mounting part and inverter device using power distribution mounting part
  • Power distribution mounting part and inverter device using power distribution mounting part
  • Power distribution mounting part and inverter device using power distribution mounting part

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0047] 1. First embodiment: bus bar

no. 2 approach

[0048] 2. The second embodiment: bus bar

[0049] 3. Comparison between the bus bar of the present invention and the bus bar of the conventional example

no. 3 approach

[0057] 4. Third embodiment: an inverter device.

[0058]

[0059] figure 1 is a schematic cross-sectional view showing an example of the bus bar according to the first embodiment of the present invention. Such as figure 1 As shown, the bus bar 12 of this embodiment includes: an insulating layer 2, a pair of first conductive members 1 that are stacked with the insulating layer 2 and are mainly responsible for power distribution, and are arranged between the insulating layer 2 and the first conductive member 1. The second conductive member 4.

[0060] The insulating layer 2 is made of insulating paper or an insulating sheet processed into a film. As a material of the insulating layer 2 , for example, insulating paper made of cellulose such as wood, aramid paper made of an aramid polymer, and insulating paper made of polyamide or the like can be used. In addition, materials made of, for example, polyamide, polyimide, epoxy resin, phenol, polyethylene, polypropylene, polye...

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Abstract

The present invention is a power distribution mounting component operable at high voltages. More specifically, the power distribution mounting component includes: an insulating layer; current-carrying first conductor layers sandwiching the insulating layer; and a second conductor layer (thinner than the first conductor layers) interposed between the insulating layer and at least one of the first conductor layers. Each the second conductor layer between the insulating layer and the overlying current-carrying first conductor layer is sufficiently thinner than the first conductor layer and is therefore formed in close adhesion to the insulating layer, thereby increasing the partial discharge inception voltage of the power distribution mounting component and therefore its insulation reliability.

Description

technical field [0001] The present invention relates to a power distribution installation component capable of handling high voltage and an inverter device using the power distribution installation component. Background technique [0002] Currently, the inverter device is used in various electrical equipment represented by hybrid electric vehicles (HEV), electric vehicles (EV), and the like. From the standpoint of recent environmental problems and promotion of energy saving, the use of inverter devices in the above-mentioned applications tends to expand year by year. In addition, with regard to the above-mentioned inverter device, power increase, energy saving, and miniaturization are aimed at, and higher voltage of internal circuits and higher-density mounting of components are being promoted. [0003] The inverter device is mainly composed of a power module with a built-in power semiconductor element (such as an insulated gate bipolar transistor (IGBT), etc.), a capacitor...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H02G5/00H02M7/00H05K1/02
CPCH05K1/0265H02G5/005H02M7/003
Inventor 楠川顺平松本启纪
Owner HITACHI LTD