Array substrate, liquid crystal display device and manufacture method for array substrate
The technology of an array substrate and a manufacturing method, which is applied in the field of liquid crystal display, can solve problems such as low resistivity anti-electromigration ability, TFT pixels cannot be fully charged, and wire patterns cannot be produced, so as to achieve high processing efficiency and low manufacturing effect.
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Embodiment 1
[0039] The metal electrode of this embodiment includes an adhesive layer 300, and a conductive layer 200 arranged on the adhesive layer 300. The conductive layer 200 can be made of copper, silver, gold and other metals with excellent electrical conductivity. The conductive layer 200 contains 0.7- 2at% vanadium, the conductive layer 200 is provided with VO x The barrier layer 400 of the material, the barrier layer 400 can prevent the conductive layer 200 from being oxidized.
[0040] Taking copper as an example, the metal electrode can be made by Cu-V alloy target, the specific steps are as follows (see image 3 ):
[0041] A: The content of vanadium (V) in the Cu-V alloy target is 8 at.%, to maintain the Cu-V alloy target in a stable metal solid solution state, see figure 2 , we can know the temperature required for Cu-V alloy targets with different ratios to reach the metal solid solution state. Of course, the composition range of vanadium in Cu-V alloy target can be exte...
Embodiment 2
[0048] In this embodiment, the conductive layer 200 of the metal electrode includes the first conductive layer 210 integrally formed with the adhesive layer 300, and the VO x The barrier layer 400 of material is integrally formed with the second conductive layer 220 , and the third conductive layer 230 is independently disposed between the first conductive layer 210 and the second conductive layer 220 . The first conductive layer 210 and the second conductive layer 220 contain 0.7-2 at % vanadium. The independent third conductive layer 230 can be made of high-purity metals, such as copper, silver, gold, etc., to improve the conductive performance of the conductive layer 200 .
[0049] Taking copper as an example, the metal electrode can be made by sputtering two Cu-V alloy targets and one sputtering pure copper target. The specific steps are as follows (see Figure 4 ):
[0050] A: The content of vanadium (V) in the Cu-V alloy target is 8 at.%, to maintain the Cu-V alloy tar...
Embodiment 3
[0061] This embodiment discloses another method for manufacturing the above-mentioned array substrate. Pure vanadium and pure copper are placed in different sputtering chambers, a layer of vanadium is sputtered first, then a layer of copper is sputtered, and finally a layer of copper is sputtered. Vanadium, under the vacuum and temperature environment described in the examples, the vanadium on the lower surface generates VO x Si y , the vanadium on the upper surface is processed by oxygen ashing to generate VO x , the middle layer of copper forms the conductive layer, using this method, the vanadium content in the conductive layer will be significantly reduced, and the conductive performance of the conductive layer will be improved.
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Abstract
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