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Surface Mount Device and Assembly Method

A surface mount device and assembly method technology, which is applied in the direction of assembling printed circuits with electrical components, printed circuits connected with non-printed electrical components, etc., can solve problems such as unreliable fixing of circuit boards and terminals, and reduce scrapping rate effect

Inactive Publication Date: 2015-09-23
AAC ACOUSTIC TECH (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional circuit boards are provided with pads on the circuit board, and then use the pads to solder the circuit board to the device. However, after the circuit board is installed on the device, the circuit board and the device are often fixed due to the phenomenon of virtual soldering. Unreliable, even the components on the circuit board cannot be electrically connected to the outside world through the pad due to the phenomenon of virtual soldering

Method used

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  • Surface Mount Device and Assembly Method
  • Surface Mount Device and Assembly Method
  • Surface Mount Device and Assembly Method

Examples

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Embodiment Construction

[0018] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0019] Such as figure 1 and figure 2 As shown, the present invention provides a surface mount device 1, which includes a PCB substrate 10, a housing 11 assembled on the PCB substrate 10 to form an accommodating space, and electronic components (not shown) accommodated in the accommodating space marked), the electronic components are fixed on the PCB substrate 10 .

[0020] Such as image 3 and Figure 4 As shown, the housing 11 is fixed on the PCB substrate 10 by conductive glue. The periphery of the PCB substrate 10 is provided with a notch 12 that runs through the upper and lower surfaces of the PCB substrate 10. The notch 12 is preferably in an arc shape that is easy to process. on pad 13, then combine the figure 2 As shown, the pad 13 includes an arc-shaped first part 131 that is accommodated in the notch 12 and matches the shape of the notc...

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PUM

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Abstract

The invention relates to a surface mounted device and an assembly method. The surface mounted device comprises a printed circuit board (PCB) substrate, a shell and an electronic component, wherein the shell is arranged on the PCB substrate to form an accommodating space; the electronic component is accommodated in the accommodating space; notches which penetrate through the upper surface and the lower surface of the PCB substrate are formed at the periphery of the PCB substrate; and bonding pads which are used for welding the PCB substrate to a client and play a role in electric conduction are arranged on inner walls of the notches. The notches are formed at the periphery of the PCB substrate, and the bonding pads are arranged in the notches, so that tin can be added into the notches to avoid the phenomenon that poor pseudo soldering is caused when the PCB substrate is fixed with the client by welding so as to reduce the scrap rate of the product.

Description

【Technical field】 [0001] The invention relates to installing electronic components or devices, in particular to a surface mounting device and an assembly method. 【Background technique】 [0002] With the development of socio-economic technology, there has been a sharp increase in the number and types of devices utilizing circuit boards. The frequency with which devices, chips, and housings are mounted to circuit boards has also increased. Improvements to device mounting can help advance device-mounted end products and can significantly reduce product cost and complexity. [0003] Device mounting can be accomplished by soldering, bonding, and other similar methods. Traditional circuit boards are provided with pads on the circuit board, and then use the pads to solder the circuit board to the device. However, after the circuit board is installed on the device, the circuit board and the device are often fixed due to the phenomenon of virtual soldering. It is not reliable, and...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34H05K1/18
Inventor 柳林何杰俞胜平
Owner AAC ACOUSTIC TECH (SHENZHEN) CO LTD