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Abrasive articles, method for their preparation and method of their use

一种制品、磨料颗粒的技术,应用在制备所述新型研磨制品领域,能够解决不均匀研磨条件等问题,达到优异平面化特性、高材料去除速率、优异成本效益的效果

Inactive Publication Date: 2012-10-31
BASF SE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, locally inhomogeneous grinding conditions still exist

Method used

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  • Abrasive articles, method for their preparation and method of their use
  • Abrasive articles, method for their preparation and method of their use
  • Abrasive articles, method for their preparation and method of their use

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-10

[0216] Preparation of Aqueous Suspensions of Solid Abrasive Particles (A1)-(A10)

[0217] General procedure:

[0218] Each diluted with water contains 30% by weight. The average primary particle size is 12nm (measured by laser light scattering), the BET surface area is 227m 2 / g of silica nanoparticles (NexSil TM 12, Nyacol Nano Technologies, Inc.) with a pH value of 10 and these aqueous suspensions with a pH value of 2 or 3 after treatment with ion exchange resins and reacted with different modifiers (C). The modifiers (C) and the amounts of the substances used are listed in Table 1.

[0219] Table 1: Reaction conditions for the preparation of aqueous suspensions of solid abrasive particles (A1)-(A10)

[0220]

[0221] Suspensions of solid abrasive particles (A1)-(A10) are particularly suitable for the preparation of CMP reagents.

[0222] Examples 11-20 and Control Experiments C1 and C2

Embodiment 11-20

[0225] For Examples 11-20, 0.2% by weight glycine (the weight percentages are based on the total weight of the resulting CMP slurry) was added to the solid abrasive particles (A1)-(A10) containing 0.1% by weight of one of Examples 1-10 in each suspension. The pH of the system was adjusted to 5.0 by adding potassium hydroxide or nitric acid. Thereafter, 1% by weight of hydrogen peroxide was added, and then a control test was carried out. The suspensions of Examples 1-10 were used to prepare the CMP reagents of Examples 11-20 in the following manner:

Embodiment 10-- Embodiment 20

[0236] An aqueous solution comprising 1% by weight of hydrogen peroxide and 0.2% by weight of glycine (the weight percentages being based on the total weight of the aqueous solution) was used for control test C1.

[0237] For control run C2, 1% by weight hydrogen peroxide and 0.2% by weight glycine (the weight percentages are based on the total weight of the resulting CMP reagent) were added to unmodified NexSil TM 12 in suspension.

[0238] The SER of the CMP reagents of Examples 11-20 and the CMP reagents of Control Tests C1 and C2 were determined as follows:

[0239] Before each test, the copper pans were first conditioned, washed, dried and then weighed. For Examples 11-20 and Control Runs C1 and C2, the copper disks were conditioned by polishing them for 30 seconds with the slurry used in the corresponding Example or Control Run. The copper disk was then held with a pair of Teflon covered clamps to reduce contamination and then immersed directly in the stirred CMP reag...

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Abstract

Abrasive articles containing solid abrasive particles (A) selected from the group consisting of inorganic particles, organic particles and inorganic-organic hybrid particles (al) having an average primary particle size of from 1 to 500 nm as determined by laser light diffraction and having electron donor groups (a2) chemically bonded to their surface are provided. The said solid abrasive particles (A) are distributed throughout or on top of or throughout and on top of a solid matrix (B). A method for manufacturing abrasive articles and a method for processing substrates useful for fabricating electrical and optical devices are provided. The said methods make use of the said abrasive articles.

Description

field of invention [0001] The present invention relates to novel abrasive articles. Furthermore, the present invention relates to a method of preparing said novel abrasive article. Last but not least, the invention relates to a method of using said novel abrasive article. [0002] Citation [0003] Documents cited in this application are hereby incorporated by reference in their entirety. Background of the invention [0004] Electrical equipment, especially semiconductor integrated circuits (ICs); liquid crystal panels; organic electroluminescent panels; printed circuit boards; micromachines; DNA chips, microdevices, and magnetic heads; ICs; and optical devices, especially optical glasses such as photomasks, lenses and prisms; inorganic conductive films such as indium tin oxide (ITO); optical integrated circuits; optical switching elements; optical waveguides; optical single crystals such as optical fibers Solid-state laser single crystals; sapphire substrates for blue l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/14
CPCB24B37/245C09K3/1436B24D11/001H01L21/3212B24B37/11B24B37/24B24B37/26B24B57/02C09K3/14H01L21/304
Inventor C·库雅特Y·李K·拉欣
Owner BASF SE