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Modular heat sink for led lights

An LED lamp and modular technology, which is applied to semiconductor devices of light-emitting elements, cooling/heating devices of lighting devices, lighting and heating equipment, etc., can solve the problem that the heat dissipation capacity of radiators cannot be fully utilized, and the product cost increases problem, to achieve the effect of simple and diversified manufacturing process and cost saving

Inactive Publication Date: 2016-06-01
OSRAM GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this has caused another problem, that is, at lower power, the temperature of the LED lamp is much lower than the maximum limit temperature, so that the heat dissipation capacity of the radiator cannot be fully utilized, thereby increasing the cost of the product

Method used

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  • Modular heat sink for led lights
  • Modular heat sink for led lights
  • Modular heat sink for led lights

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Embodiment Construction

[0023] Various specific embodiments of the present invention are given below, and these embodiments are only used to describe the present invention in detail, and should not be construed as limiting the present invention.

[0024] Such as image 3 As shown, a modular heat sink according to a first embodiment of the present invention is shown. In this modular heat sink, it is composed of two modular heat sink parts, that is, the first module heat sink part 1 and the second module heat sink part 2, and the second module heat sink part 2 is connected by snap joint, thread joint, welding or the like. It is fixed on the first module cooling part 1, so as to be in thermal communication with the first module cooling part 1, so that the heat can be conducted from the first module cooling part 1 to the second module cooling part 2, and then radiated to the outside to achieve LED lights The purpose of heat dissipation.

[0025] In order to conduct heat better, a heat-conducting part m...

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Abstract

The present invention provides a modular heat sink for LED lamps, wherein the modular heat sink includes at least two modular heat sink parts, and the at least two modular heat sink parts are thermally connected together for use in Especially high-power LED lamps, and make it possible to adjust the lighting angle of the LED lamps within the range of 0° to 180°. The modular heat sink of the present invention can be combined with different numbers n of modular heat sink components for various power requirements of LED lamps, thereby saving the cost of the heat sink, and the manufacturing process of the modular heat sink components of the radiator is simple and diverse. At the same time, the lighting angle of the LED light can be adjusted within the range of 0-180°.

Description

technical field [0001] The invention relates to a modular radiator, in particular to a modular radiator for LED lamps. Background technique [0002] Because LEDs can emit light using relatively low power, they have been gradually popularized and used in various aspects of production and life. However, although the LED has the advantage of low power consumption, the LED has the disadvantage of high operating temperature. As we all know, in LED lighting, limited by existing chip technology, 85% of the power driving LED will be converted into heat energy, and only 15% of the power will be converted into light energy. LED is extremely sensitive to temperature. The temperature of LED directly affects the life and optical performance of LED. The higher the temperature, the shorter the life of LED and the smaller the light output. Therefore, the design of the heat dissipation structure is very important in the design of the LED lamp. This heat dissipation structure is called a r...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21V29/71F21V29/85F21V17/10F21Y115/10
CPCF21S8/026F21V21/30F21V29/713F21V29/77F21Y2115/10
Inventor 熊慧珺李皓陈小棉陈友
Owner OSRAM GMBH