Drive device
A driving device and a technology of rotating position, which is applied in electromechanical devices, cooling/ventilation devices, and connection with control/drive circuits, etc., which can solve the problems of large physical configuration of motors and larger physical configurations
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no. 1 example ）
[0121] Such as figure 1 As shown in , the drive device 1 according to the first embodiment includes a motor 30 , a power supply circuit 50 , and a control circuit 70 . The driving device 1 generates rotational torque on the steering wheel shaft 92 and assists the steering operation of the steering wheel 91 through the transmission device 93 fixed to the steering wheel shaft 92 , which is the rotational axis of the steering wheel 91 of the vehicle. More specifically, when the driver manipulates the steering wheel 91 , the steering torque generated on the column 92 due to the manipulation is detected by the torque sensor 94 . In addition, vehicle speed information is acquired through a controller area network (CAN) in order to assist the driver's steering operation through the steering wheel 91 . When such a mechanism is used, not only the steering can be assisted, but also the manipulation of the steering wheel 91 for keeping the lane on the highway, guiding to a parking space...
no. 2 example ）
[0185] Such as Figure 8 As shown in , the drive device 2 of the second embodiment includes six semiconductor modules 501 , 502 , 503 , 504 , 505 , and 506 . In order to distinguish the semiconductor modules 501 to 506 from each other, Figure 8 The reference numerals in are used to denote them as U1 semiconductor module 501, V1 semiconductor module 502, W1 semiconductor module 503, U2 semiconductor module 504, V2 semiconductor module 505, and W2 semiconductor module 506, respectively.
[0186] The three semiconductor modules 501 to 503 from U1 to W1, and the three semiconductor modules 504 to 506 from U2 to W2 are interconnected by a bus bar 507 to form a module unit. The busbar 507 has an interconnection function and acts as a power supply line.
[0187] The semiconductor modules 501 to 506 are mounted on a heat sink 611 extending from the end wall 106 of the motor housing 101 in the same direction as the centerline direction of the shaft 401 .
[0188] Such as Figure 8...
no. 3 example ）
[0200] Such as Figure 11 As shown in , the driving device 3 of the third embodiment includes six semiconductor modules 511 , 512 , 513 , 514 , 515 , and 516 . In order to distinguish the semiconductor modules 511 to 516 from each other, Figure 11 The reference numerals in are used to denote them as U1 semiconductor module 511, V1 semiconductor module 512, W1 semiconductor module 513, U2 semiconductor module 514, V2 semiconductor module 515, and W2 semiconductor module 516, respectively.
[0201] The three semiconductor modules 511 to 513 of U1 to W1, and the three semiconductor modules 514 to 516 of U2 to W2 are interconnected through the bus bar 507 to form a module unit. The busbar 507 has an interconnection function and acts as a power supply line.
[0202] The semiconductor modules 511 to 516 are mounted on a heat sink 621 extending from the end wall 106 of the motor housing 101 in the same direction as the centerline direction of the shaft 401 .
[0203] Such as Fi...
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