Chip packaging system, chip packaging method, injecting device, and stamping and injecting linkage device

Abstract

The invention discloses a chip packaging method. The chip packaging method comprises the following steps: stamping a groove for accommodating soft solder on a framework-type chip holder; injecting molten soft solder into the groove; cooling the soft solder and forming the soft solder for use; melting the soft solder in a rail of chip packaging equipment; bonding a chip on the soft solder; and reflowing and cooling the soft solder so as to finish the chip packaging work. The invention further discloses an injecting device, a stamping and injecting linkage device and a chip packaging system. The groove is stamped in the framework-type chip holder, and the soft solder in the groove cannot overflow, so that the phenomenon that the soft solder is nonuniform due to overflowing of the soft solder, caused by low Z-direction precision of a welding head of a chip packaging machine or inconsistent local tin bonding property, can be avoided; the thickness and the uniformity of the soft solder can be controlled as required, so that the thickness and the uniformity of the soft solder meet required thickness and uniformity indexes; and a tin pointing and film pressing device and corresponding actions thereof are omitted, so that the production efficiency can be improved and manufacturing requirements on the chip packaging system are lowered.

Description

technical field [0001] The invention relates to integrated circuit packaging technology, in particular to a chip packaging system, method, injection device and stamping and injection linkage device. Background technique [0002] In the process of semiconductor packaging, especially power devices, it is necessary to bond the chip to the lead frame carrier through soft solder to realize the electrical connection function between the chip and the lead frame. [0003] The thickness and uniformity of the soft solder are the main indicators for considering the bonding of the chip with the soft solder. In the traditional soft solder chip loading mode, the soft solder is melted and then dotted on the surface of the frame loading table. Since the melted soft solder is semicircular or spherical and has fluidity, it is difficult to control the thickness of the soft solder, and the uniformity is not good, which is likely to cause poor heat conduction and electrical conductivity of the s...

AI Technical Summary

Problems solved by technology

[0010] In the sixth step, due to the reflow of the soft solder 30, the soft solder 30 will face toward the middle and rise up (that is, keep standing up), and the reflow action is completed. However, due to the unrestricted overflow, the thickness of the soft solder 30 is likely to vary after reflow. uniform

[0012] 1. It cannot be solved that when the amount of soft solder 30 is too much or too little, the shape of the soft solder 30 meets the requirements, which indirectly affects the thickness and uniformity of the soft solder 30 under the chip 50;

[0013] 2. The speed of the equipment is affected by the tin spot device 20 and the laminating device 50, and the difficulty and cost of equipment manufacturing are relatively high;

[0014] 3. The soft solder 30 formed by pressing the film is squeezed by the welding head of the chip loading machine when sticking the chip, which may easily cause the overflow of the soft solder, resulting in insufficient thickness of the soft solder 30 under the chip 50 or a large difference in the thickness of the soft solder 30;

[0015] 4. Lamination technology cannot solve the phenomenon that the thickness of the soft solder is too small or uneven due to poor reflow of the soft solder 30 when the frame loading table 10 has poor solderability

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