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Surface preparation of die for improved bonding strength

A technology that combines surface and adhesion, applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., can solve problems such as difficulty in matching thermal expansion coefficients

Inactive Publication Date: 2012-12-05
QUALCOMM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, matching thermal expansion coefficients can be difficult to achieve due to the properties of different materials

Method used

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  • Surface preparation of die for improved bonding strength
  • Surface preparation of die for improved bonding strength
  • Surface preparation of die for improved bonding strength

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] see figure 1 In the exemplary embodiment shown, electronic package 100 has improved bond strength to prevent or reduce warping. Package 100 includes a substrate 102 , a first die 104 and a second die 106 . The first die 104 may be referred to as the lower or tier 1 die and the second die 106 may be referred to as the upper or tier 2 die. Substrate 102, which may be made of silicon, glass, or other semiconductor material, may be coupled to a system motherboard (not shown) or another packaging substrate by a plurality of solder balls 108 or flip-chip bumps. Likewise, the first die 104 may be coupled to the substrate 102 by bumps 110 (eg, microbumps, solder balls, etc.), or any other means for effectuating die-to-substrate attachment. An underfill layer 122 may also be added between the first die 104 and the substrate 102 to improve package reliability. Likewise, an underfill material 124 may be disposed between the first and second die.

[0019] Near the front surface...

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Abstract

A surface preparation method for improved adhesion in an electronic package system. The method of improving adhesion in the electronic package system includes depositing a passivation layer on a bonding surface and roughening at least a portion of the passivation layer. A coating material is deposited on the passivation layer. The bonding surface can be part of a semiconductor or package substrate. The roughening process can be performed by a chemical or mechanical process. In another embodiment, an electronic package system includes a bonding surface of a semiconductor or package substrate. A passivation layer is deposited on the bonding surface and a portion of the passivation layer is roughened for improved adhesion. A coating material is deposited on the roughened portion of the passivation layer.

Description

technical field [0001] The present invention relates generally to electronic packaging, and in particular to surface preparation methods for improving adhesion in electronic packaging systems. Background technique [0002] In electronic packaging, one or more die may be coupled together or to an organic substrate to form a package. The reliability of electronic packages can be negatively affected due to warpage and other physical defects. This is especially true for thin-die and fine-pitch flip-chip applications, where it can be difficult to bond or couple one die to another die or package substrate during fabrication. A thin die, for example, may have a thickness of less than 100 μm, and a packaging substrate may have a thickness of less than 300 μm. [0003] When coupling a die to another die or a packaging substrate, warpage may break die-to-die attachment or die-to-substrate attachment. In some electronic packages, the type of underfill material used between the die a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56H01L23/31H01L25/065
CPCH01L2224/16227H01L2224/13083H01L2224/0557H01L23/3142H01L2224/05647H01L25/0657H01L2924/01078H01L2224/73203H01L24/16H01L23/293H01L2924/15311H01L2224/05666H01L2224/13155H01L24/13H01L2924/01057H01L2225/06517H01L2224/05147H01L2224/13147H01L21/563H01L2224/13166H01L2224/05022H01L2224/131H01L2225/06568H01L2224/05572H01L2924/014H01L2225/06541H01L2924/01029H01L23/3192H01L2224/16145H01L2225/06513H01L23/3135H01L2224/16225H01L23/3128H01L2924/01033H01L2924/00014H01L2924/0002H01L2224/0401H01L2924/14H01L2224/05552H01L2924/00H01L25/065H01L23/31
Inventor 阿尔温德·钱德拉舍卡朗顾时群乌尔米·雷
Owner QUALCOMM INC
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