Tie Bar And Mold Cavity Bar Arrangements For Multiple Leadframe Stack Package
A technology of lead frame and guide bar, which is applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., and can solve the problem of no lead frame
Active Publication Date: 2015-07-22
NAT SEMICON CORP
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
Of course, introducing multilayer and / or multipart leadframe structures, such as those in the previous references, tends to lead to additional difficulties and problems not found in simpler leadframes
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[0033]Exemplary applications of the devices and methods according to the invention are described in this section. These examples are provided only to enrich the text and aid in the understanding of the invention. It will be apparent to a person skilled in the art that the present invention may be practiced without some or all of these specific details. In other instances, well known process steps have not been described in detail in order not to unnecessarily obscure the present invention. Other applications are possible, so the following examples are not to be considered limiting.
[0034] In the following detailed description, reference is made to the accompanying drawings, which form a part hereof, and in which are shown by way of illustrations certain embodiments of the invention. While these embodiments are described in sufficient detail to enable those skilled in the art to practice the invention, it should be understood that these examples are not limiting; therefore,...
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A semiconductor chip package having multiple leadframes is disclosed. Packages can include a first leadframe having a first plurality of electrical leads and a die attach pad having a plurality of tie bars, a second leadframe generally parallel to the first leadframe and having a second plurality of electrical leads, and a mold or encapsulant. Tie bars can be located on three main sides of the die attach pad, but not the fourth main side. Gaps in the first and second plurality of electrical leads can be enlarged or aligned with each other to enable the elimination of mold flash outside the encapsulated region, which can be accomplished with mold cavity bar protrusions. Additional components can include a primary die, a secondary die, an inductor and / or a capacitor. The first and second leadframes can be substantially stacked atop one another, and one or both leadframes can be leadless leadframes.
Description
technical field [0001] The present invention relates generally to the packaging of integrated circuit devices, and more particularly to leadframe packaging using multi-chip modules, system-in-package structures, or other complex components. Background technique [0002] Many integrated circuit ("IC") device packages utilize metal leadframes to provide electrical interconnection between the integrated circuit die and external components. Such leadframes typically include numerous metal leads extending from the chip and contained within the same common plane in order to facilitate easy mass production of identical leadframes. Many leadframes also include a die attach pad ("DAP") in the same common plane as the metal leads, usually at or near the center. The DAP can support the chip during assembly of the package and provide a ground or other electrical contact for the package, and can also aid in the thermal management of the package by providing a good thermal conduction pat...
Claims
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IPC IPC(8): H01L23/495H01L23/32H01L23/52
CPCH01L23/49575H01L2924/19041H01L23/49537H01L24/97H01L23/49589H01L23/495H01L23/3107H01L21/565H01L21/561H01L2924/181H01L2924/14H01L2924/00
Inventor L·H·M@E·李K·Y·胡
Owner NAT SEMICON CORP