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Conductive thermosetting adhesive tape

A technology of thermosetting and adhesive tape, applied in the direction of conductive adhesives, adhesives, adhesive types, etc., can solve the problems of decreased electrical conductivity and increased contact resistance, and achieve the effect of stabilizing electrical conductivity

Inactive Publication Date: 2012-12-26
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the above-mentioned conductive adhesive tape is used for the internal wiring of the electronic device, etc., the contact resistance of the portion where the conductive adhesive tape is pasted gradually increases, resulting in a problem that the electrical conductivity decreases over time.
It can be seen that the current situation is that there is no conductive adhesive tape that can exert stable electrical conductivity when used for a long time or under harsh environmental conditions.

Method used

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  • Conductive thermosetting adhesive tape
  • Conductive thermosetting adhesive tape
  • Conductive thermosetting adhesive tape

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0135] (Preparation of samples)

[0136] Dissolve the acrylic polymer to be measured in the eluent, prepare a 0.1% THF solution of the acrylic polymer, let it stand for 1 day, filter it with a 0.45 μm membrane filter, and use the obtained filtrate as a sample, under the following measurement conditions Under the GPC measurement.

[0137] (measurement conditions)

[0138] GPC device: HLC-8120GPC (manufactured by Tosoh Corporation)

[0139] Column: TSKgel superAWM-H, TSKgel superAW4000, TSKgel superAW2500 (manufactured by Tosoh Corporation)

[0140] Column size: 6mmφ×15cm each, 45cm in total

[0141] Column temperature: 40°C

[0142] Eluent: 10mM-LiBr, 10mM-phosphoric acid / THF (tetrahydrofuran)

[0143] Flow rate: 0.4mL / min

[0144] Inlet pressure: 4.6MPa

[0145] Injection volume: 20μL

[0146] Detector: Differential Refractometer

[0147] Standard sample: polyethylene oxide

[0148] Data processing device: GPC-8020 (manufactured by Tosoh Corporation)

[0149] The co...

manufacture example

[0256] Put 0.279 g of 2,2'-azobis{2-[1-(2-hydroxyethyl)-2-imidazoline-2- Propane] dihydrochloride (trade name "VA-060", manufactured by Wako Pure Chemical Industries, Ltd.) (polymerization initiator) and 100 g of ion-exchanged water were stirred for 1 hour while introducing nitrogen gas. It was kept at 60°C, and 400 g of 66 parts by weight of butyl acrylate (n-butyl acrylate) (BA), 29 parts by weight of acrylonitrile (AN), 5 parts of acrylic acid (AA), 0.04 The emulsion obtained by adding 41 parts by weight of dodecyl mercaptan (chain transfer agent) and 2 parts by weight of polyoxyethylene lauryl ether sodium sulfate (emulsifier) ​​to 41 parts by weight of ion-exchanged water for emulsification (monomer raw material emulsion) for emulsion polymerization. After the dropwise addition of the emulsion of the monomer raw material was completed, it was kept at the same temperature for 3 hours for aging. The aqueous dispersion (emulsion) of the acrylic polymer thus obtained was dr...

preparation example

[0258]Acetic acid in which 100 parts by weight of the above-mentioned acrylic polymer [a copolymer composed of 66 parts by weight of butyl acrylate (BA), 29 parts by weight of acrylonitrile (AN), and 5 parts of acrylic acid (AA) as monomer components] is dissolved In the ethyl ester solution, 10 parts by weight (non-volatile content) of etherified phenolic resin (trade name "CKS-3898" (manufactured by Showa Denko Co., Ltd.)) was mixed and dissolved, and stirred to prepare a thermosetting adhesive composition (A) ( solution).

[0259] Production example of thermosetting adhesive tape winding body

[0260] On the release paper coated with polysiloxane, apply the thermosetting adhesive composition (A) so that the thickness after drying is 25 μm, and dry at 100 ° C for 3 minutes to form a thermosetting adhesive layer (thickness 25 μm ). Then, a tin-clad copper foil (tin-plated copper foil, thickness: 35 μm) was bonded to the thermosetting adhesive layer.

[0261] Next, the resu...

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PUM

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Abstract

Disclosed is a conductive adhesive tape which can exhibit extremely stable electroconductivity upon use over a long duration and / or use under severe environmental conditions even when applied in a small area. The conductive thermosetting adhesive tape includes a metallic foil; and a thermosetting adhesive layer on one side of the metallic foil. The thermosetting adhesive layer has a bond strength before curing of 2 N / 20 mm or more and a bond strength after curing of 10 N / 20 mm or more. The conductive thermosetting adhesive tape is preferably one including the metallic foil; the thermosetting adhesive layer on one side of the metallic foil; and a terminal exposed from the surface of the thermosetting adhesive layer, in which the conductive thermosetting adhesive tape has a total area of the terminal present per 30 mm 2 of the surface of the thermosetting adhesive layer of from 0.1 to 5 mm 2 .

Description

technical field [0001] The present invention relates to a conductive thermosetting adhesive tape. More specifically, the present invention relates to a conductive thermosetting adhesive tape for applications such as making electrical conduction between two spaces apart. Background technique [0002] Conductive adhesive tapes have electrical conductivity (especially electrical conductivity in the thickness direction), and are used for electrical conduction between two spaced parts, electromagnetic wave shielding applications, and the like. As such a conductive adhesive tape, for example, conventionally known ones include a metal foil and an adhesive layer (pressure-sensitive adhesive layer) provided on one side of the metal foil, and on the adhesive layer-covered side of the metal foil A conductive adhesive tape (for example, refer to Patent Documents 1 to 4) that penetrates the adhesive layer and has a conduction portion at its tip, and a conductive adhesive tape such as ni...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09J9/02C09J133/08C09J161/14C09J7/28
CPCC09J2201/122C09J2201/602C09J2461/00C09J2201/61C09J2433/00C09J2400/163C09J2203/326B32B15/04C09J2201/20C09J7/0292C09J2201/32C09J7/0296C09J7/28C09J7/29Y10T428/2804C09J2301/206C09J2301/18C09J2301/314C09J2301/304C09J2301/122
Inventor 中尾航大大学纪二武藏岛康古田喜久野中崇弘
Owner NITTO DENKO CORP