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Radiator for computer motherboard

A radiator and motherboard technology, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of overheating, burning out, affecting the normal use of the computer, etc. Effect

Active Publication Date: 2016-05-11
东莞市隆慧电子科技有限公司
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  • Summary
  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

[0002] The structure of the heat sink of the traditional computer motherboard is simple, only the heat dissipation fins are used for heat dissipation, and the heat dissipation effect is not ideal. When the motherboard works for a long time, it is easy to cause the motherboard to overheat and cause burnout, which affects the normal use of the computer.

Method used

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  • Radiator for computer motherboard
  • Radiator for computer motherboard
  • Radiator for computer motherboard

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Embodiment Construction

[0011] see figure 1 and figure 2 , a radiator for a computer main board of the present invention, comprising a heat dissipation pipe 4 and several heat dissipation fins 2 installed on the periphery of the heat dissipation pipe 4, a base 1 is installed at the bottom of the heat dissipation pipe 4, and an exhaust fan 3 is installed at the top thereof, Exhaust fan 3 is installed on heat dissipation pipe 4 by fan support, and the two ends of this heat dissipation pipe 4 are closed structures, and cooling liquid 7 is housed in it, as Figure 4 As shown, the heat dissipation liquid is water.

[0012] see image 3 , in order to further ensure the heat dissipation effect of the present invention, the present invention designs a special structure specially designed for heat dissipation fins, which ensures the rapid loss of heat, specifically: heat dissipation sleeves are installed on the periphery of the heat dissipation fins 2 Ring 5, the heat dissipation collar 5 is evenly provid...

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Abstract

The invention relates to a heat radiator for a computer mainboard. The heat radiator comprises a heat radiating pipe and a plurality of heat radiating fins arranged on the periphery of the heat radiating pipe; the bottom end of the heat radiating pipe is provided with a base while the top end of the heat radiating pipe is provided with an exhaust fan; both ends of the heat radiating pipe are of sealed structures; and heat radiating liquid is filled in the heat radiating pipe. The heat radiator has the following advantages that the heat radiating speed is high, and the heat of the mainboard is lost as soon as possible in the greatest degree of assurance, so that the service life of the mainboard is prolonged.

Description

technical field [0001] The invention relates to a radiator for a computer motherboard. Background technique [0002] Traditional computer motherboards have a simple structure of radiator heat pipes, only cooling fins for heat dissipation, and the cooling effect is not ideal. When the motherboard is working for a long time, it is easy to cause the motherboard to overheat and cause burnout, which affects the normal use of the computer. Contents of the invention [0003] In order to overcome the defects of the prior art, the invention provides a radiator for a computer motherboard. The technical solution of the present invention is: a radiator for a computer motherboard, comprising a heat dissipation pipe and several heat dissipation fins installed on the periphery of the heat dissipation pipe, a base is installed at the bottom of the heat dissipation pipe, and an exhaust fan is installed at the top of the heat dissipation pipe. The two ends of the tube are closed structures...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20
Inventor 赵永海
Owner 东莞市隆慧电子科技有限公司
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