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Semiconductor structure and method of forming same, pmos transistor and method of forming same

A technology of semiconductors and transistors, applied in the field of semiconductors, can solve problems such as dislocation of silicon-germanium bulk layers, and achieve the effect of avoiding excessive differences in germanium content

Active Publication Date: 2016-12-14
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The problem solved by the present invention is to provide a semiconductor structure and its forming method, as well as a PMOS transistor and its forming method, so as to solve the problem of dislocation of silicon germanium body layer in the existing PMOS transistor

Method used

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  • Semiconductor structure and method of forming same, pmos transistor and method of forming same
  • Semiconductor structure and method of forming same, pmos transistor and method of forming same
  • Semiconductor structure and method of forming same, pmos transistor and method of forming same

Examples

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no. 1 example

[0047] refer to figure 1 and figure 2 Step S101 is executed to provide a semiconductor substrate 100 , a gate structure 120 is formed on the surface of the semiconductor substrate 100 , and grooves 110 are formed in the semiconductor substrate 100 on both sides of the gate structure 120 .

[0048] The gate structure 120 includes a gate dielectric layer (not marked) and a gate electrode layer (not marked) on the gate dielectric layer. The substrate 100 may be silicon, silicon germanium, silicon-on-insulator, etc., and the substrate 100 includes an isolation structure (not shown), the isolation structure may be a silicon oxide shallow groove isolation structure, and the isolation structure is used for Devices formed on the surface of the semiconductor substrate 100 are isolated. The material of the gate dielectric layer can be high-k dielectric material such as silicon oxide or hafnium oxide, and the material of the gate can be doped polysilicon, metal, metal silicide or othe...

no. 2 example

[0073] Please refer to Figure 7 The difference between the method for forming a PMOS transistor provided by the second embodiment of the present invention and the method for forming a PMOS transistor provided by the first embodiment is that:

[0074]It also includes forming a second graded silicon germanium layer 370 between the surface of the silicon germanium bulk layer 150 and the covering layer 360 . The content of germanium in the second graded silicon germanium layer 370 decreases along the direction from the silicon germanium bulk layer 150 to the covering layer 360 . Specifically, as long as the germanium in the second silicon-germanium graded layer 370 shows a decreasing trend as a whole, it can be linearly alkaline or wave-like, for example, the germanium in the second silicon-germanium graded layer Along the direction from the silicon germanium bulk layer to the silicon germanium capping layer, the content of decreases linearly, parabolicly, or curvilinearly.

[...

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Abstract

A semiconductor structure and its forming method, and a PMOS transistor and its forming method, the forming method of the PMOS transistor provided by the present invention includes: providing a semiconductor substrate, a gate structure is formed on the surface of the semiconductor substrate, and Grooves in the semiconductor substrate on both sides of the gate structure; a silicon germanium seed layer is formed at the bottom of the groove; a first silicon germanium graded layer is formed on the surface of the silicon germanium seed layer; A silicon germanium body layer is formed on the graded layer, and the surface of the silicon germanium body layer is lower than the surface of the semiconductor substrate, and source / drain electrodes are formed in the silicon germanium body layer on both sides of the gate structure. The invention can reduce the dislocation of the silicon germanium body layer in the PMOS transistor and improve the performance of the semiconductor device.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a semiconductor structure and its forming method, a PMOS transistor and its forming method. Background technique [0002] In the existing manufacturing process of semiconductor devices, since stress can change the energy gap and carrier mobility of silicon materials, it has become an increasingly common means to improve the performance of MOS transistors through stress. Specifically, by properly controlling the stress, the mobility of carriers (electrons in NMOS transistors and holes in PMOS transistors) can be increased, thereby increasing the driving current, thereby greatly improving the performance of MOS transistors. [0003] At present, the embedded germanium silicon (Embedded GeSi) technology is used, that is, the silicon germanium material is first formed in the area where the source region and the drain region need to be formed, and then doped to form the source region and ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/336H01L29/06H01L29/78
Inventor 涂火金林静
Owner SEMICON MFG INT (SHANGHAI) CORP