Substrate storage container
A technology for storage containers and substrates, which is used in semiconductor/solid-state device manufacturing, electrical components, packaging, etc., can solve the problems of damage to the substrate storage container, inability to thicken and contaminate the disk-shaped substrate, and achieve the effect of safe storage.
Active Publication Date: 2014-09-10
MIRAIAL CO LTD
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AI Technical Summary
Problems solved by technology
This is because the thickness of the disc-shaped substrate cannot be thickened corresponding to the diameter
[0009] Therefore, when vibration or impact is applied to the substrate storage container to bend it, the disk-shaped substrate held in the substrate storage container in a suspended state from the substrate temporary placement piece may be separated from the substrate temporary placement piece. Chip contact (or impact) causes damage and contamination in the substrate storage container
Method used
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[0031] Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0032] figure 1 is a perspective view of the substrate storage container of the first embodiment of the present invention, figure 2 is its top sectional view. 1 is a container main body for accommodating a plurality of disc-shaped substrates W formed in a thin disc shape in a state of being arranged in parallel. The container main body 1 arranges each disk-shaped substrate W in the state stored in the horizontal direction when the disk-shaped substrate is taken in and out.
[0033] In the container main body 1 , a plurality of disk-shaped substrates W are accommodated in a direction facing each other face to face so that there are gaps between them. But when figure 1 In FIG. 2 , a state in which only one disk-shaped substrate W is housed in the lowermost position in the container main body 1 is shown. In addition, although the disk-shaped substrate W in this emb...
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The position of a substrate temporal placement piece (4) is set so that the substrate temporal placement piece (4) does not overlap a disc-shaped substrate (W) from a viewing direction perpendicular to the surface of the disc-shaped substrate (W), when a lid (20) is attached to a substrate transfer opening (2) of a container main body (1) and the disc-shaped substrate (W) is pressed to a location where the substrate is positioned and held by a back side holding portion (3). Thereby, even if the disc-shaped substrate (W) stored in the container main body (1) is bent due to vibration, impact, etc., there is no danger that the substrate (W) is in contact with the substrate temporal placement piece (4), and the disc-shaped substrate (W) having a larger diameter can be safely stored.
Description
[0001] technology area [0002] The present invention relates to a substrate storage container for storing a plurality of thin disk-shaped substrates such as semiconductor wafers and circular quartz glass substrates during storage and transportation. Background technique [0003] The substrate storage container is generally provided with a container main body for accommodating a plurality of disk-shaped substrates such as semiconductor wafers in a state of being arranged in parallel. The container main body is formed with a substrate pick-up opening for picking up the disk-shaped substrate. Furthermore, the lid body for closing the substrate carrying opening is provided so as to be detachably attached to the substrate carrying opening from the outside. [0004] In order to keep the disk-shaped substrate in the container body in a state that does not shake, a rear side holding part is arranged in the area on the back side viewed from the substrate pick-up opening in the conta...
Claims
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IPC IPC(8): B65D85/86
CPCH01L21/67383H01L21/67369
Inventor 永岛刚
Owner MIRAIAL CO LTD