Laser cutting machine
A cutting machine and laser technology, used in glass cutting devices, glass manufacturing equipment, laser welding equipment, etc., can solve the problems of insufficient laser intensity, insignificant cutting effect, and excessive cutting of products.
Inactive Publication Date: 2013-01-09
SHIN YUAN ELECTRONICS PROD KUNSHAN
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Problems solved by technology
Because the thickness of the wires on the wire board is different, the laser intensity required for cutting is also different. However, most of the laser cutting machines in the prior art use a fixed-intensity laser machine for cutting, resulting in some products being overwhelmed due to excessive laser intensity. Damage caused by cutting, or the cutting effect of some products is not obvious due to insufficient laser intensity
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[0013] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be noted that all the drawings of the present invention are in simplified form and use inaccurate scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.
[0014] Please refer to figure 1 , the present invention provides a laser cutting machine, including a frame 10, a laser radiation device 20, a cutting transfer 30, a focusing mirror 40, a focus adjustment seat 60 and a laser refraction device 50, wherein the laser radiation device 20 is arranged on the The bottom of the frame 10, the cutting transfer 30 is arranged on the frame 10 above the laser radiation device 20, the focusing mirror 40 is arranged on the frame 10 and is on the same level as the cutt...
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The invention discloses a laser cutting machine, comprising a framework, a laser emitting device, a cutting shifting device, a focusing mirror, a focusing adjusting seat and a laser refraction device, wherein the laser emitting device is arranged at the bottom of the framework; the cutting shifting device is arranged on the framework above the laser emitting device; the focusing mirror is arranged on the framework and is located on the same horizontal plane of the cutting shifting device; a laser adjusting seat is connected with the focusing mirror; and the position of the laser refraction device corresponds to the positions of the laser emitting device and the focusing mirror. According to the laser cutting machine disclosed by the invention, the cutting effect of laser can be controlled through adjusting the strength of the laser; cutting positions of the laser of the reflection and the refraction of the laser can be adjusted; and small-range adjustment can be carried out according to requirements of different products so as to ensure that each time of work can achieve the best effect.
Description
technical field [0001] The invention relates to the field of mechanical equipment, in particular to a laser cutting machine. Background technique [0002] Laser cutting machine, also known as laser cutting machine, cuts the workpiece by emitting high-energy laser. Because the laser cutting machine can cut through the glass panel, and the cutting precision is high, therefore, in the production process of the liquid crystal display, the wire plate arranged under the liquid crystal panel is usually cut. Because the thickness of the wires on the wire board is different, the laser intensity required for cutting is also different. However, most of the laser cutting machines in the prior art use a fixed-intensity laser machine for cutting, resulting in some products being overwhelmed due to excessive laser intensity. Damage caused by cutting, or some products have inconspicuous cutting effect due to insufficient laser intensity. [0003] Therefore, how to provide a laser cutting ...
Claims
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IPC IPC(8): B23K26/38B23K26/04C03B33/08B23K26/042B23K26/046
Inventor 郑吉宏王均哲
Owner SHIN YUAN ELECTRONICS PROD KUNSHAN