Double vacuum loading cavity of common vacuum system
A vacuum system and vacuum technology, applied in vacuum evaporation coating, ion implantation coating, metal material coating process, etc., can solve the problems of high installation and adjustment difficulty, low production efficiency, complex structure of vacuum process chamber, etc. To achieve the effect of convenient processing and assembly, time and cost reduction, and high reliability
Active Publication Date: 2014-02-05
PIOTECH CO LTD
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Problems solved by technology
[0007] The purpose of the present invention is to solve the above problems, and mainly solve the technical problems of the existing vacuum process chambers, such as complex structure, high difficulty in assembly and adjustment, and low production efficiency
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[0021] refer to Figure 1-Figure 4 , the dual-chamber vacuum loading chamber of the shared vacuum system is mainly composed of a chamber assembly, a wafer support assembly, a bottom flange assembly and a transparent cover.
[0022] The above-mentioned wafer support assembly includes: a wafer support 2 and a wafer support tray 3 .
[0023] Wafer holders 2 are four on each layer and made into a circular arc that matches the outer diameter of the wafer to fix the wafer. Two layers (or multi-layers) of wafer holders 2 are fastened to the wafer holder tray 3 with screws Above, the wafer holder tray 3 is fastened to the bottom of the chamber 15 with screws, and the distance between the wafer holders 2 is such that the communication channel 8 is just exposed.
[0024] The above-mentioned bottom flange assembly includes: bottom flange 7, gas diffuser 12, vacuum gauge 11, vacuum angle valve 10, vacuum pipeline 9 and other parts. One side of the bottom flange 7 is a sealing surface, w...
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A double vacuum loading cavity of a common vacuum system mainly solves the technical problems of complicated structure, high assembly and adjustment difficulty and low production efficiency of an existing vacuum process cavity. The double vacuum loading cavity mainly comprises a cavity component, a wafer support component, a bottom flange component and a transparent cover plate. The bottom flange component comprises a bottom flange, a gas diffuser, a vacuum meter, a vacuum angle valve and a vacuum pipeline, one surface of the bottom flange is a sealing surface, the lower side of a common vacuum chamber at the bottom of the cavity is sealed by an O-shaped ring, a hole on the other surface of the bottom flange is respectively connected with the gas diffuser, the vacuum meter, the vacuum angle valve and the vacuum pipeline through screws and is similarly sealed by an O-shaped ring, the vacuum angle valve is connected to a pump unit through the vacuum pipeline, and the gas diffuser is connected with a nitrogen pipeline to form the common vacuum chamber. The double vacuum loading cavity has the advantages that the structure is reasonable, a machining process is simple, the cost is low, double cavities share the vacuum chamber, the volume is small, and vacuumizing and air backfilling time and cost of the double vacuum loading cavity are greatly reduced as compared with those of a similar product.
Description
technical field [0001] The invention relates to a vacuum loading chamber, through which the crystal element can enter the vacuum working environment from the atmospheric environment without backfilling the vacuum chamber to the atmospheric pressure. The invention belongs to the technical field of semiconductor thin film deposition application and preparation. Background technique [0002] In the semiconductor production process, coating the wafer is one of the most important and frequent processes in the front-end process. Various coating processes are carried out in different degrees of vacuum, and raw wafers and finished wafers always need to come in and out of the vacuum environment frequently. In order to avoid the influence of foreign particles on the process as much as possible, increase the service life of the vacuum process chamber and improve production efficiency, it is necessary to avoid frequent switching of the vacuum process chamber between vacuum and atmosphe...
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IPC IPC(8): C23C14/22C23C14/56
Inventor 姜崴
Owner PIOTECH CO LTD