Multi-step-shaped cooling-fin-type closed cooling device

A technology of heat sink and heat sink, applied in the direction of cooling/ventilation/heating transformation, etc., can solve problems such as temperature imbalance and achieve the effect of temperature balance

Inactive Publication Date: 2013-01-16
SHAANXI HUANGHE GROUP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the deficiencies of the prior art, the present invention provides a multi-step heat sink type closed heat dissipation device, which solves the problem of temperature imbalance after densely arranged T/R components with high heat flux density on the active radar antenna, thereby realizing Consiste

Method used

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  • Multi-step-shaped cooling-fin-type closed cooling device
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  • Multi-step-shaped cooling-fin-type closed cooling device

Examples

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Example Embodiment

[0031] Specific example 1

[0032] 1) T / R component length dimension L 1 =80mm, width dimension L 2 =37mm, quantity N=34, so the air duct size A=37mm, B=80mm, δ=4mm, flange thickness size d 0 =6mm, L=(L 2 +δ)·N / 2+2·d 0 =709mm.

[0033] 2) T / R component heating power Φ=14W, N=34, C P =0.24kcal / kg·℃, ρ=1.077kg / m 3 , Δt=20℃, substituting into the formula Q=Φ·N / (C P ·Ρ·Δt)=1.3m 3 / min, so the air volume of the fan is ≥Q, the size is 120X120X38mm, and the maximum air volume is 5.7m 3 / min axial flow fan. LF21 anti-rust aluminum is selected for the heat dissipation duct. Through computer simulation, optimization and testing, it is determined that the heat dissipation duct size C=50mm and D=65mm, the thickness of the heat sink d=1mm, and the distance between the heat sink y=2.5mm; Shows that the number of heat sinks in the heat dissipation duct is M=18, the number of steps is K=5, and the step size is a 1 ~a 5 , B 1 ~b 5 , A 1 =210mm, a 2 =135mm, a 3 =100mm, a 4 =110mm, a 5 = 70mm, b 1 =2...

Example Embodiment

[0037] Specific example 2

[0038] 1) T / R component length dimension L 1 =60mm, width dimension L 2 =25mm, quantity N=20, so the air duct size A=25mm, B=60mm, δ=4mm, flange thickness size d 0 =6mm, L=(L 2 +δ)·N / 2+2·d 0 =302mm.

[0039] 2) T / R component heating power Φ=10W, N=20, C P =0.24kcal / kg·℃, ρ=1.077kg / m 3 , Δ=20℃, substituted into the formula Q=Φ·N / (C P ·Ρ·Δt)=0.55m 3 / min, so the air volume of the fan is ≥Q, the size is 60X60X32mm, and the maximum air volume is 1.2m 3 / min axial flow fan. Copper alloy H62 is selected as the heat dissipation air duct. Through computer simulation, optimization and experiment, it is determined that the heat dissipation air duct size C=45mm and D=45mm, the thickness of the heat sink d=1.2mm, and the distance between the heat sink y=3mm; The number of fins in the heat dissipation duct is 10, the number of steps is 4, and the step size a 1 ~a 4 , B 1 ~b 4 , A 1 =50mm, a 2 =100mm, a 3 =90mm, a 4 =50mm, b 1 =5mm, b 2 =12mm, b 3 =18mm, b 4 =20mm.

[...

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Abstract

The invention provides a multi-step-shaped cooling-fin-type closed cooling device. Multistage step-shaped cooling fins are arranged on the two opposite surfaces of a cooling air channel inner cavity; the height values of the multi-step-shaped cooling fins are increased in a stepped way along an airflow trend; guiding grooves are formed in the outer wall of a cooling air channel; transmitter/receiver (T/R) components are tightly attached with the guiding grooves; the two end faces of the cooling air channel are provided with an air inlet and an air outlet respectively; the cooling air channel is arranged in a shell closed cavity; and holes which are matched with the air inlet and the air outlet are respectively formed in the two end faces of the antenna shell closed cavity for arranging a blower fan and an exhaust fan respectively. By the device, the problem of unbalanced temperature of the T/R components after the T/R components are densely arranged is solved, the capability of resisting a severe environment of an active phased array antenna is improved, and the device has the advantages of simple structure, small size and light weight, and is easy to process.

Description

technical field [0001] The invention relates to a heat dissipation device. Background technique [0002] A large number of highly dense T / R components are installed in the active phased array antenna, and the microwave power devices in the T / R components are mostly miniaturized microwave integrated circuits. Due to low efficiency, T / R components will generate a lot of heat loss, which will cause the temperature of T / R components to rise sharply. Excessive temperature will affect the working performance and service life of components, and may cause damage to components in severe cases. , therefore, thermal design is a very important issue in active phased array antennas. The heat dissipation methods currently applied to active phased array antennas mainly include liquid cooling and air cooling. Both liquid-cooled heat dissipation and air-cooled heat dissipation can achieve the effect of uniform temperature heat dissipation for T / R components with high heat flux density, and...

Claims

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Application Information

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IPC IPC(8): H05K7/20
Inventor 杨和刘卫刚李振兴郑之伦
Owner SHAANXI HUANGHE GROUP
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