Novel combined type polishing grinding head

Abstract

The invention discloses a novel combined type polishing grinding head, which mainly comprises a main shaft, a grinding head cover, a grinding head rotating mounting seat, a plane grinding assembly and a swinging linear grinding assembly, wherein the plane grinding assembly is mounted on the grinding head rotating mounting seat; the plane grinding assembly is provided with a planet gear shaft; a planet gear is fixed at the upper part of the planet gear shaft; the planet gear is meshed with a sun gear which is fixed on the grinding head cover and is coaxially sleeved on the main shaft; the planet gear is meshed with a driving gear; the swinging linear grinding assembly is provided with an abrasion block seat swinging rotating shaft which is arranged horizontally; an eccentric wheel mechanism driven by an end face gear is connected to the tail end of the abrasion block seat swinging rotating shaft; the rotating shaft of the end face gear is horizontally arranged; and the end face gear is meshed with the driving gear. As the plane grinding assembly and the swinging linear grinding assembly are simultaneously arranged on the polishing grinding head, plane grinding and linear grinding are synchronously carried out on one polishing grinding head, and the grinding efficiency and quality are improved.

Description

technical field [0001] The invention relates to a polishing grinding head, in particular to a combined polishing grinding head with the functions of plane grinding and linear grinding. Background technique [0002] With the improvement of people's living standards and aesthetic concepts, people have put forward higher requirements for the quality and surface smoothness of ceramic products. The ceramic polished tiles are therefore beautiful and durable, adapt to the needs of the current people, and become one of the most widely used ceramic products in modern architectural decoration projects. [0003] There are two types of polishing and grinding methods for existing ceramic polishing tiles, one is plane grinding and the other is oscillating linear grinding. The surface grinding method has the advantages of large grinding area and high grinding efficiency; while the oscillating linear grinding method has the advantages of strong grinding pressure and high self-sharpening of...

AI Technical Summary

Problems solved by technology

As people put forward higher requirements for the quality and surface smoothness of ceramic products, it is often necessary to superimpose the use of plane grinding and linear grinding to meet the requirements. However, due to the limitations of the existing grinding head structure design, the existing polishing grinding The head is only equipped with a surface grinding assembly or an oscillating linear grinding assembly separately, that is, it has a separate surface grinding or oscillating linear grinding function. Surface grinding and linear grinding often require two groups of grinding heads to process separately, so the required processing equipment It takes up a lot of space in the factory building, and the efficiency is low, and the effect of separate processing of surface grinding and linear grinding is not as good as synchronous processing, because when processing separately, first surface grinding and then linear grinding, or first linear grinding and then plane grinding Grinding, ceramic tiles need to be transferred in space for further plane or linear grinding. In this process, the surface of the ground ceramic tiles has been cooled, so when the next plane or linear grinding is carried out, the time required for grinding and Work is not reduced

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