Device for detecting warping degree of circuit board assembly and detecting method thereof
A technology for circuit boards and assemblies, applied in the direction of mechanical solid deformation measurement, etc., can solve problems such as cracking of solder joints, damage to components, and difficulty in detecting circuit board warpage, avoiding components and solder joints, and facilitating contact Effect
Active Publication Date: 2015-05-27
NO 510 INST THE FIFTH RES INST OFCHINA AEROSPAE SCI & TECH
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Problems solved by technology
When the soldered circuit board is installed inside the chassis, the circuit board with an uneven surface will be forced to fit the mechanical structure under the action of mechanical external forces such as fasteners, and the mechanical stress on components and solder joints will be greater. , these internal stresses will be exposed during the environmental test or use of the product, causing cracking of solder joints and damage to components, which will directly affect the reliability of the product
[0003] In the circuit board processing industry, there are clear regulations and inspection requirements for the warpage index of circuit boards (bare boards) that have not been soldered with components (QJ519A-99 "Printed Circuit Board Test Methods", but this method is only applicable to Warpage detection of bare board
When the components are installed on the circuit board, the two sides of the circuit board are occupied by components, pins or solder joints, and there is a lack of a plane as a reference for warpage detection. Therefore, the warpage detection of the circuit board after soldering difficulty
Method used
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[0019] The preferred embodiments of the present invention will be described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.
[0020] Such as figure 1 As shown, an auxiliary device for warpage detection of circuit board assemblies includes a support 4, a lock nut 3, an adjusting disc 2 and a fine-tuning screw 1, the fine-tuning screw is set on the adjusting disc, and the adjusting disc is set on the support The top of the seat can be rotated on the support to adjust its height on the support, and the lock nut is arranged under the adjustment disc on the support to fix the height of the adjustment disc. Thread fit is adopted between the adjusting disc and the support. The top of the fine-tuning screw is spherical. The adjustment plate is matched with the support through the thread, and the...
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The invention discloses an auxiliary device for detecting warping degree of a circuit board assembly. The auxiliary device for detecting the warping degree of the circuit board assembly comprises a support, a locking nut, an adjusting disc and a fine tuning screw, wherein the fine tuning screw is arranged on the adjusting disc, the adjusting disc is arranged at the top end of the support and rotates on the support to adjust the height of the support, and the locking nut is arranged under the adjusting disc on the support and can fix the height of the adjusting disc. A method for detecting the warping degree of the circuit board assembly comprises the steps of utilizing a principle that the auxiliary device and three points can confirm a plane to build a datum plane, detecting the warping degree of the circuit board assembly relative to the datum plane based on the datum plane, accordingly calculating the warping degree of the circuit board assembly and achieving the measurement of the warping degree of the assembled circuit board assembly.
Description
technical field [0001] The invention relates to the field of circuit board measurement, in particular to a device for detecting the warpage of a circuit board assembly for measuring the warpage of a circuit board and a detection method thereof. Background technique [0002] At present, in the production of electronic products, after the components are soldered on the printed circuit board, due to the cooling and shrinkage of the solder during the soldering process of the components, and the characteristics of the circuit board material changing with temperature, especially the design The influence of component layout will inevitably cause warping and deformation of the circuit board after welding, resulting in bow and twist, so that components and solder joints are subjected to welding stress. When the soldered circuit board is installed inside the chassis, the circuit board with an uneven surface will be forced to fit the mechanical structure under the action of mechanical ...
Claims
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IPC IPC(8): G01B5/30
Inventor 成钢
Owner NO 510 INST THE FIFTH RES INST OFCHINA AEROSPAE SCI & TECH