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Fluid handling structure, a lithographic apparatus and a device manufacturing method

A technology for fluid processing and lithography equipment, applied in micro-lithography exposure equipment, optomechanical equipment, thin material processing, etc., can solve unwanted problems

Active Publication Date: 2015-04-22
ASML NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This requires additional or more powerful electric motors, and turbulence in the liquid may cause undesired or unintended effects

Method used

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  • Fluid handling structure, a lithographic apparatus and a device manufacturing method
  • Fluid handling structure, a lithographic apparatus and a device manufacturing method
  • Fluid handling structure, a lithographic apparatus and a device manufacturing method

Examples

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Effect test

Embodiment Construction

[0042] figure 1 A lithographic apparatus according to an embodiment of the invention is schematically shown. The lithography equipment includes:

[0043] - an illumination system (illuminator) IL configured for conditioning a radiation beam B (eg, ultraviolet (UV) radiation or deep ultraviolet (DUV) radiation);

[0044] - a support structure (e.g. a mask table) MT configured to support a patterning device (e.g. a mask) MA and connected to a first positioning device PM configured to precisely position the patterning device MA according to determined parameters ;

[0045] - a support table (such as a sensor table) for supporting one or more sensors, or a substrate table WT configured to hold a substrate (such as a resist-coated substrate) W and configured to use connected to a second positioner PW for precisely positioning the surface of the stage (eg, the surface of the substrate W) according to determined parameters; and

[0046] - a projection system (e.g. a refractive pr...

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Abstract

A fluid handling structure for a lithographic apparatus, the fluid handling structure having, at a boundary of a space configured to contain immersion fluid to a region external to the fluid handling structure: a meniscus pinning feature to resist passage of immersion fluid in a radially outward direction from the space; a gas supply opening at least partly surrounding and radially outward of the meniscus pinning feature; and optionally a gas recovery opening radially outward of the gas supply opening, wherein the gas supply opening, or the gas recovery opening, or both the gas supply opening and the gas recovery opening, has an open area per meter length which has a variation peripherally around the space.

Description

technical field [0001] The invention relates to a fluid handling structure, a lithographic apparatus, a method of fabricating a device using a lithographic apparatus, and a method of operating a lithographic apparatus. Background technique [0002] A lithographic apparatus is a machine that applies a desired pattern to a substrate, usually a target portion of the substrate. For example, lithographic apparatus may be used, for example, in the manufacture of integrated circuits (ICs). In this case, a patterning device, alternatively referred to as a mask or reticle, may be used to generate the circuit pattern to be formed on the individual layers of the IC. The pattern can be transferred onto a target portion (eg, comprising a portion, one or more dies) on a substrate (eg, a silicon wafer). Typically, the pattern is transferred by imaging the pattern onto a layer of radiation sensitive material (resist) provided on the substrate. Typically, a single substrate will contain a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCG03F7/70341Y10T137/2931
Inventor D·贝斯塞蒙斯E·H·E·C·奥姆梅伦R·H·M·考蒂A·J·贝藤M·里彭C·M·诺普斯
Owner ASML NETHERLANDS BV