Micro-electromechanical systems (MEMS) microphone

A microphone and chip technology, applied in the field of microphones, can solve problems affecting product user experience, resource waste, reliability issues, etc., to reduce the risk of damage, prolong service life, and improve reliability.

Inactive Publication Date: 2013-02-13
SHANDONG GETTOP ACOUSTIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the key device inside the MEMS microphone—the MEMS chip, that is, the diaphragm material on the vibration component is a thin and fragile single crystal or polycrystalline silicon structure, which will be excessively deformed and broken under the impact of loud sound or air pressure, which will cause the entire The microphone has no sound signal output due to damage to the vibrating component
In addit

Method used

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  • Micro-electromechanical systems (MEMS) microphone
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  • Micro-electromechanical systems (MEMS) microphone

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Embodiment Construction

[0022] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0023] refer to figure 1 The structure schematic diagram of the existing MEMS microphone is shown, the existing MEMS microphone includes: a printed circuit board 1, a MEMS chip 2, an integrated circuit chip (Application Specific Integrated Circuit, ASIC) 5, a diaphragm 11, a microphone shell 8, a sound hole 12.

[0024] Wherein, the microphone housing 8 is combined with the printed circuit board 1 to form a cavity, and the ASIC chip 5 and the MEMS chip 2 are built in. The connection between the microphone housing 8 and the printed circuit board 1 is sealed with a sealant 9 , or with solder paste. The printed circuit board 1 is provided with a sound hole 12 . External sound pressure or air pressure triggers the diaphragm 11 on t...

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Abstract

The invention provides a micro-electromechanical systems (MEMS) microphone. The MEMS microphone comprises an integrated circuit chip built-in a cavity formed by a microphone shell and a printed circuit board in connected mode, an MEMS chip and a vibrating diaphragm arranged on the MEMS chip. The printed circuit board is provided with sound holes; the integrated circuit chip and the MEMS chip are fixed on the printed circuit board, and electric connection of the integrated circuit chip, the MEMS chip and the printed circuit board is achieved through metal wires; and a gasket including a plurality of air holes is arranged between the MEMS chip and the printed circuit board. By means of the gasket which includes the plurality of air holes and is arranged between the MEMS chip and the printed circuit board, when large sound pressure or air pressure passes the sound holes, damping can be increased, impact to the vibrating diaphragm can be reduced, further the MEMS chip can be simply and effectively protected, the breakage risk of the MEMS chip vibrating diaphragm can be reduced, reliability of the MEMS microphone is improved, and the service life of the MEMS microphone is prolonged.

Description

technical field [0001] The present invention relates to the technical field of microphones, in particular to a MEMS microphone. Background technique [0002] MEMS microphones are microphones made using Microelectromechanical Systems (MEMS) technology. Wherein, the microphone is also called a microphone. [0003] The new microphone contains two chips -- a MEMS chip and an application-specific integrated circuit (ASIC) -- packaged in a surface-mount device package. The MEMS chip consists of a rigid perforated back electrode and a flexible silicon membrane that acts as a capacitor. This elastic silicon membrane converts sound waves into changes in capacitance. ASIC chips are used to detect capacitance changes and convert them into electrical signals for output. [0004] Compared with traditional condenser microphones (ECM), MEMS microphones not only have good acoustic performance, but also have a high signal-to-noise ratio and consistent sensitivity, and their performance i...

Claims

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Application Information

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IPC IPC(8): H04R19/04
Inventor 万景明
Owner SHANDONG GETTOP ACOUSTIC
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