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Vacuum pad

A technology of vacuum pads and vacuum holes, which is used in the manufacture of conveyors, electrical components, semiconductor/solid-state devices, etc., can solve problems such as strong vacuum force and distortion of thin-plate substrates

Inactive Publication Date: 2013-03-06
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Specifically, when the substrate is transferred, the substrate is sucked by the pad and then moved. At this time, the vacuum force for sucking the substrate is strong, so the phenomenon that the thin-plate substrate is warped (warpage) frequently occurs.

Method used

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  • Vacuum pad
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Embodiment Construction

[0029] The purpose, specific advantages, and novel features of the present invention will be clarified by the following detailed description and preferred embodiments with reference to the accompanying drawings. It should be noted that in the present invention, when assigning reference numerals to constituent parts in each drawing, the same constituent parts are limited, and even if they are shown in different drawings, they are marked with the same symbols as much as possible. In addition, when describing the present invention, a detailed description of related well-known techniques will be omitted if it is considered that the gist of the present invention will be obscured. In the present invention, terms such as "first" and "second" are used to distinguish one component from other components, but the components themselves are not limited by the terms.

[0030] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawin...

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Abstract

A vacuum pad of the invention comprises an absorption pad for absorbing a substrate, and a supporting strip formed in a manner of dividing the absorption pad into a plurality of regions from a substrate absorption surface of the absorption pad to an inner side.

Description

technical field [0001] This invention relates to vacuum pads. Background technique [0002] Components such as semiconductor wafers, printed circuit boards (PCBs), and semiconductor module ICs pass strict quality inspections and are shipped as products. [0003] At present, printed circuit boards are gradually becoming thinner and thinner, but the actual situation is that the thin boards cannot be effectively dealt with in the equipment and substrate manufacturing process, and various problems arise. [0004] For example, during the process or when the completed thin-plate type printed circuit board is transferred, problems such as breakage often occur due to the characteristics of the thin plate. [0005] Specifically, when transferring a substrate, the pad absorbs the substrate and then moves it. At this time, the vacuum force for sucking the substrate is strong, so thin-plate substrates are frequently warped. Contents of the invention [0006] The present invention wa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65G47/91
CPCB65G47/911B65G2249/045H01L21/67712H01L21/6838H05K13/021H05K13/0408
Inventor 金东藓金显埈郑镇一李延喆田丞镐朴城辰曹汉瑞
Owner SAMSUNG ELECTRO MECHANICS CO LTD