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Multi-layer circuit board manufacturing method

A technology of a multilayer circuit board and a manufacturing method, which is applied in the direction of multilayer circuit manufacturing, etc., can solve the problems such as the inability to seal the gap of the board edge groove and the infiltration of resin into the board edge groove.

Active Publication Date: 2015-10-07
SHENNAN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, when the length of the edge groove is more than 10mm, the dry film cannot seal the gap of the edge groove, and it is more likely that the edge groove will seep into the resin

Method used

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  • Multi-layer circuit board manufacturing method
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  • Multi-layer circuit board manufacturing method

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Embodiment Construction

[0034] In order to describe the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.

[0035] see figure 1 as well as figure 2 , the invention provides a kind of multilayer circuit board manufacturing method, comprises the following steps:

[0036] Step S201 drills via holes on the multilayer circuit board, and the surface of the multilayer board has a copper layer 21;

[0037] In step S202 electroplating, a copper layer 22 is plated on the interior of the via hole 20 and the surface of the multilayer board;

[0038] Step S203 attaching a photosensitive film on the surface of the multi-layer board, exposing the pasted photosensitive film, and developing the unexposed photosensitive film to make the outer layer pattern of the circuit board;

[0039] Step S204 vacuum plugging, plugging resin 25 in the via hole 20, and then...

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PUM

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Abstract

The invention provides a multilayer circuit board manufacturing method which utilizes vacuum hole plugging and does not cause resin permeation into board edge slots. The multilayer circuit board manufacturing method includes the steps of (1) manufacturing through holes on a multilayer circuit board, (2) manufacturing an outer graph of the circuit board, (3)plugging vacuum hole , (4) milling the board edge slots, and (5) manufacturing copper layers on the walls of the milled board edge slots. Since the board edge slots are manufactured after holes are plugged, the problem about resin permeation into the board edge slots is fundamentally avoided during the vacuum hole plugging process.

Description

technical field [0001] The invention relates to a method for manufacturing a circuit board, in particular to a method for manufacturing a multilayer circuit board with side wall metallization design. Background technique [0002] The sidewall metallized circuit board refers to a circuit board with metallized sidewalls of the edge grooves of the board, so that the electronic components and the side walls of the metallized edge grooves of the board are conducted. [0003] Its existing production process is as follows figure 1 Shown: [0004] S101 Drill via holes, mill board side slots → S102 Make copper layer in via holes and board side slots → S103 Film attachment, exposure, development → S104 Vacuum plug holes → Film removal. [0005] When the via holes on the circuit board need to be plugged by vacuum plugging, and the side wall metallization is designed, the conventional one-time drilling and milling, followed by electroplating to make copper layers, and the processing m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
Inventor 冷科刘海龙崔荣罗斌张利华王成勇
Owner SHENNAN CIRCUITS