Biodegradable heat-shrinkable material, biodegradable heat-shrinkable film and preparation method of biodegradable heat-shrinkable film
A biodegradable and heat-shrinkable technology, applied in the field of biodegradable heat-shrinkable film and its preparation, can solve the problem of high processing cost and achieve the effect of simple processing technology
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0017] The present embodiment provides a biodegradable heat-shrinkable material, the preparation process of which is as follows:
[0018] Take 500g PLA (number average molecular weight 45000), 200g PBAT (number average molecular weight 35000), 300g PCL (number average molecular weight 80000) and 10g ethylene isophthalate copolymer (number average molecular weight 8000, melting point 110°C), After mixing, add the twin-screw extruder for melt-kneading. The parameters of melt-kneading are as follows (twin-screw extruder; Φ=26mm; L / D=40; the temperature from the feeding zone to the die head is: 150 ℃, 180℃, 200℃, 200℃, 200℃, 200℃, 200℃, 200℃, 195℃, 195℃; pressure 0.3~1.2MPa; torque 54%; feeding rate 23s), made at about 230℃ The blend is then extruded and pelletized, and dried to obtain chips. The obtained slices were injection-molded with a mold temperature of 110° C. and a cooling time of 120 seconds. The formed sheet was tested, and the test data are shown in Table 1.
Embodiment 2
[0020] The present embodiment provides a biodegradable heat-shrinkable material, the preparation process of which is as follows:
[0021] Take 500g PLA (number average molecular weight 80000), 200g PBAT (number average molecular weight 60000), 300g PCL (number average molecular weight 60000) and 50g ethylene isophthalate copolymer (number average molecular weight 9000, melting point 120°C), mix Then, add the twin-screw extruder for melt-kneading. The parameters of melt-kneading are as follows (twin-screw extruder; Φ=26mm; L / D=40; the temperature from the feeding zone to the die head is: 150℃ , 180℃, 200℃, 200℃, 200℃, 200℃, 200℃, 200℃, 195℃, 195℃; pressure 0.3~1.2MPa; torque 54%; feeding rate 23s), prepared at about 230℃ The blend is then extrusion granulated and dried to produce chips. The obtained slices were injection-molded with a mold temperature of 110° C. and a cooling time of 120 seconds. The formed sheet was tested, and the test data are shown in Table 1.
Embodiment 3
[0023] The present embodiment provides a biodegradable heat-shrinkable material, the preparation process of which is as follows:
[0024] Take 500g PLA (number-average molecular weight 110,000), 200g PBAT (number-average molecular weight 80,000), 300g PCL (number-average molecular weight 100,000) and 100g ethylene isophthalate copolymer (number-average molecular weight 9000, melting point 135°C), after mixing , adding a twin-screw extruder for melt-kneading, and the parameters of melt-kneading are as follows (twin-screw extruder; Φ=26mm; L / D=40; the temperature from the feeding area to the die area is: 150℃, 180°C, 200°C, 200°C, 200°C, 200°C, 200°C, 200°C, 195°C, 195°C; pressure 0.3~1.2MPa; torque 54%; feeding rate 23s), a total of The mixture is then extruded and pelletized, and dried to obtain chips. The obtained slices were injection-molded with a mold temperature of 110° C. and a cooling time of 120 seconds. The formed sheet was tested, and the test data are shown in...
PUM
| Property | Measurement | Unit |
|---|---|---|
| melting point | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More - R&D
- Intellectual Property
- Life Sciences
- Materials
- Tech Scout
- Unparalleled Data Quality
- Higher Quality Content
- 60% Fewer Hallucinations
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com

