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Apparatus, system and method for processing substrates

A substrate processing device and substrate processing method technology, applied in the direction of discharge tubes, electrical components, semiconductor/solid-state device manufacturing, etc., can solve the problems of complex semiconductor equipment processes and increased number of processes

Active Publication Date: 2016-01-20
SEMES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] As semiconductor devices are miniaturized, processes for manufacturing semiconductor devices become complicated and the number of processes increases

Method used

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  • Apparatus, system and method for processing substrates
  • Apparatus, system and method for processing substrates
  • Apparatus, system and method for processing substrates

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Embodiment Construction

[0045] The terms and drawings used herein are exemplary terms and drawings for describing exemplary embodiments of the present invention, and thus, the present invention is not limited thereto.

[0046] Also, detailed descriptions related to well-known technologies will be excluded in order not to unnecessarily obscure the subject matter of the present invention.

[0047] Hereinafter, a substrate processing apparatus 1000 according to an embodiment of the present invention will now be described.

[0048] The substrate processing apparatus 1000 may perform a process on a substrate S. Referring to FIG. The process may be any process used to manufacture semiconductor devices, flat panel displays (FPDs), and devices including circuits on thin films. Furthermore, the substrate S may be any substrate used to manufacture semiconductor devices, FPDs, and devices including circuits on thin films. For example, the substrate S may be a silicon wafer, or one of various wafers, organic s...

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Abstract

PURPOSE: An apparatus for treating a substrate, a system using the same and a method thereof are provided to shorten the transfer path of a substrate by directly transferring the substrate to a process module through a buffer chamber. CONSTITUTION: A load port(1110) is mounted on a container for mounting a substrate. Multiple process modules process the substrate. A transport module(1100) is arranged between the load port and the process module and transfers the substrate between the container and the process module. A buffer chamber is arranged between adjacent process modules and provides a space for transferring the substrate.

Description

technical field [0001] The present invention disclosed herein relates to an apparatus, system, and method for processing a substrate, and more particularly, to a substrate processing apparatus having a cluster structure, a substrate processing system, and a substrate processing method using the substrate processing system . Background technique [0002] Semiconductor devices can be manufactured by forming circuit patterns on a substrate such as a silicon wafer by various multi-stage processes including photolithography. This multi-stage process is carried out in corresponding chambers. Therefore, operations of placing a substrate in one chamber to perform a process and then placing a substrate in another chamber to perform another process are repeated to manufacture a semiconductor device. [0003] As semiconductor devices are miniaturized, processes for manufacturing semiconductor devices become complicated and the number of processes increases. Therefore, in the total t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01J37/32H01L21/67
CPCH01L21/6719H01L21/67276H01L21/67769H01L21/67772
Inventor 金炯俊
Owner SEMES CO LTD